Manufacturing Engineering Manager

GPD Optoelectronics is seeking an accomplished technical lead packaging engineer with a diverse skill set to join our team. As an Optomechanical Packaging and Manufacturing Engineer, you will oversee continuous improvement of GPD's production assembly and packaging of optoelectronic devices, in addition to managing the development of advanced packaging solutions including package design, material selections, qualification, and documentation. You'll work closely with quality, design engineers, process engineers, supply chain, operations, facilities, and outside consultants. Responsibilities include the development of advanced packaging solutions for photodiode devices for various market segments. You will provide packaging solutions which meet demanding product requirements while balancing the need for reliability and cost. You will follow the NPI gate process, ensure the products meet both internal and customer specifications as required, and that the product is designed for manufacturing. You will also be responsible for ensuring the repeatability and reproducibility of our products and make suggestions where applicable on next gen fabrication / assembly capabilities. This full-time, exempt position will report to the Director of Operations and will be located at our Salem, NH facility. Responsibilities

• Responsible for establishing baseline process capability and managing process and technology improvements to support GPD's roadmap and sales projections.
• Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture.
• Develop and document manufacturing techniques, materials, tools and processes related to back-end Photodiode assembly.
• Performs analyses and selects techniques to solve problems and enhance product yield and process flows.
• Establish high yielding, cost effective processes based on product need and customer requirements.
• Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.
• Evaluates and validates process and design alternatives based on product manufacturability.
• Provide technical leadership within manufacturing engineering to drive a new product or process to successful release - meeting on time delivery and cost targets.
• Provides processes that are robust and repeatable against product specifications and that support the quoted cost.
• Lead the manufacturing team in the direction for improving and streamlining existing processes for increased accuracy and efficiencies.
• Have a full understanding and up-to-date knowledge of the NPI process as well as the requirements of our current (ISO9001).
• Ensure that all projects assigned are fully auditable to the current site accreditations and work with quality manager to implement any suggested quality improvements.
• Drive team meetings and coordinate actions to relevant parties as required to achieve project budget and schedule requirements. Support sales engineers as needed regarding new configurations, vetting concepts, and providing feedback or design input.
• Mentor junior staff.
• Other duties as assigned by your manager Experience
• BS in mechanical engineering or material science or closely related disciplines with at least 8 years of industrial experience in semiconductor or photonics area.
• Fluent with material properties, packaging techniques, and manufacturing disciplines.
• Demonstrated experience of working with engineering teams from different cultures in global environment.
• Strong manufacturing experience which insures high yield along with controlled process. Preferred Experience
• MSME with 6 years of experience.
• 3 years technical leadership experience in cross-functional teams.
• Experience with rapid prototype / development cycles.
• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.
• General awareness of FEA-based analysis techniques as related to photonics and PIC package designs would be distinct advantage. MISC :
• Able to lift up to 20lbs
• Travel may be required This role is restricted to U.S. persons (i.e., U.S. citizens, permanent residents, and other protected individuals under the Immigration and Naturalization Act, 8 U.S.C. 1324b(a)(3)) due to access to export-controlled technology. GPD will require proof of status prior to employment.

GPD Optoelectronics is expanding! Do you have an unwavering commitment to continuous improvement? Do you share the passionate belief that we must always strive to do better? Based out of Salem, NH, our team members are design-oriented, customer-focused, and work hard to engineer custom solutions for every client's needs. If you have an eye for detail and share our passion for the photonics industry, come join our team of professionals who are dedicated to advancing tomorrow's photo detector technology!