Packaging

Responsibilities

may include :

• Learn about Design Rules and Assembly Process
• Utilize mechanical and thermal simulation techniques
• Develop thermal / mechanical simulation best practices to enable efficient automation
• Onsite hands-on learning of semiconductor assembly processes
• Other minor activities related to documentation and continuous improvement (A3s and Lean)

Qualifications :

• BS in Materials Science, Physics or Mechanical Engineering
• Mechanical / Material Engineering skills
• Communication and presentation skills
• Ability to manage and drive problem resolution
• Demonstrate strong analytical thinking skills
• 3.0 GPA or higher

Last updated : 2024-09-13