Electronics Packaging Engineer

Job/Position Summary

The Electronics Packaging Engineer is a goal-oriented, self-motivated individual with effective verbal and written communication skills. The candidate must have a strong technical background in Electrical Engineering; supports customers technical inquiries to enable design wins; authors application notes, training materials, and datasheet applications; and assists customers in developing application circuits, reference designs, and evaluation boards, as needed.

Primary Responsibilities

• Analyzes customer and system requirements to develop basic architectural approaches and detailed specifications for various electronic products.
• Develops high-level and detailed designs consistent with requirements and specifications.
• Validates designs through various methods of review, testing and analysis.
• Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements.
• Supports Supplier Management with make/buy recommendations and other technical services of limited scope.
• Provides engineering support throughout the lifecycle of the product.
• Investigates emerging technologies to develop concepts for future product designs to meet projected requirements.
• Works under general direction.
• Perform additional functions and other duties as assigned or required.
  
  

Requirements

• Bachelor's and 5 or more years' experience, master’s degree with 3 or more years' experience or PhD degree with experience.
• Bachelor, Master or higher degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard.
• This position requires the ability to obtain U.S. Security Clearance post-start, for which the U.S. Government requires U.S. Citizenship.
• This position will require lawful access to ITAR/EAR controlled information and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements.
  
  

Knowledge, Skills, And Abilities

• Experience in Electronic Packaging Design in any of the following disciplines: airborne, space, digital, RF or power mechanical systems.
• Experience in mechanical CAD design, stress and structural analysis and test, fatigue analysis, and thermal analysis and test.
• Experience in requirements comprehension and translating them into prototype designs.
• Experience delivering working products through design, verification, and test.
• Experience working in a fast paced and dynamic environment.
• Experience working with customers and suppliers.
• Experience performing to fixed cost and schedule.
• Knowledge of filter and Integrated Passive Device concepts and test techniques.
• Knowledge of AWR, ADS, CST and HFSS Simulation Software.
• Strong leadership skills.
• Ability to work in teams.
• Proactive approach (problem solving, solution oriented, etc).
• General knowledge of digital, RF and power subsystem development.
• Airborne and Space knowledge.
• Understanding of Printed Circuit Board design.
  
  

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable)
• Prolonged periods of sitting or standing
  
  

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives and engaging all levels of the organization.