Principal Adv Packaging Tech Dev Engineer

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Job Description:

Seeking an Advanced Semiconductor Package Technology Development expert to drive innovations in advanced substrates, heterogeneous integration with 2.5D/3D assembly and advanced cooling, to support Broadcom's industry leading AI product roadmap and complement our world class IP and Silicon design skills.

Key Responsibilities:

• Lead R&D in advanced substrates, heterogenous integration, and cooling to address the scaling, performance and thermal challenges in our next gen XPU and Networking products

• Develop novel package and system architectures, in collaboration with our Business Unit experts and industry partners, for transformative advancements in packaging technology that would differentiate Broadcom products

• Identify, evaluate and qualify advanced materials and fabrication processes to productize new concepts and ideas

• Design test vehicles, for technology development and qualification, in consideration of product needs and demonstrate the results at appropriate product intercept timelines

• Work with cross-functional teams within Broadcom and industry partners on planning and execution of development projects

• Enable the manufacturing eco system to implement the qualified technologies in high volume manufacturing

Key Requirements:

• Deep knowledge and experience in architectures and process development for 2.5D and 3D Hybrid Cu Bonding integration, advanced FCBGA substrates, and cooling technologies such as microfluidic cooling

• Advanced knowledge in electrical, thermal and mechanical design aspects of advanced packages, especially for HPC and AI products

• Extensive experience in reliability testing of advanced packages and sound understanding of the failure modes and mitigation techniques

• Ability to collaborate with internal and external partners for enhancing process yields and cost effectiveness

• Demonstrated experience in advanced packaging innovations by means of patents and publications

• Ph.D. or M.S. in Materials Science, Mechanical Eng, Electrical Eng, or any other microelectronics packaging related field

• 10 years of experience in advanced substrates and 2.5D & 3D integration

• Ability to work in a fast-paced, cross-functional environment with deep thinking and problem solving skills

Preferred Skills:

• Experience with package layout and simulation (electrical / thermal/ mechanical) tools

This is a high impact, high visibility role in a team whose mission is to create transformative new technologies in advanced packaging. If you are that passionate and driven industry expert who is looking for a challenging, but equally rewarding, career with an industry leader like Broadcom, we invite you to apply!

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $127,000 - $203,000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Salary : $127,000 - $203,000