Hardware Engineer – Printed Circuit Board (PCB) Design

At Phoenix Semiconductor, we are pioneering a new approach to solving supply chain disruption due to late-gen, legacy, and mature microelectronic components. Our team is working to produce an extensive catalog of chips for the Department of Defense, automotive, medical, manufacturing, oil & gas, and OEM verticals. Headquartered in Austin, Texas our innovative process is challenging how companies solve obsolescence challenges.

Legacy chips at scale, on demand and in perpetuity.

Rethink what’s possible.

Phoenix Semiconductor Corporation, a leading innovator in the semiconductor industry, is seeking an experienced Hardware Design PCB Engineer with expertise in schematic and layout design to join our team. The ideal candidate will be responsible for designing, developing, and optimizing PCB schematics and layout to meet performance, power, and area requirements. This role involves close collaboration with cross-functional teams, including design and test engineers, to ensure the delivery of high-quality semiconductor products.

Must be a U.S. Citizen and eligible for a security clearance. Work visas will not be issued/supported.

Key Responsibilities

• Design and layout high density printed circuit boards.


• Manage symbol and footprint library.


• Create and optimize PCB layouts to meet electrical, performance, and manufacturability requirements.


• Perform Layout vs. Schematic (LVS), Design Rule Check (DRC) and Design for Manufacturing (DFM) verifications to ensure compliance.


• Work closely with system architects to translate specifications into optimized layouts.


• Collaborate with fabrication teams to enhance manufacturability and yield.


• Maintain and improve design methodologies, automation scripts, and best practices for layout efficiency.

Minimum Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or equivalent.


• Strong experience in:
  
  
  
  • PCB design/layout
  
  
  • Schematic capture
  
  
  • Hardware debugging and chip bring-up
  
  
  • Working with PCB fabrication & assembly shops
  
  
  
  

Preferred Qualifications

• SPICE simulation for signal and power integrity analysis.


• Experience in design, layout, and analysis of System-in-Packages (SiP) and/or Multi-Chip Modules (MCM).


• Knowledge of advanced package design topics including but not limited to:
  
  
  
  • Substrate design
  
  
  • Wire bonding
  
  
  • Flip-chip
  
  
  • Redistribution layer (RDL)
  
  
  
  


• Firmware Development

What We Offer

• Competitive salary and benefits package, including:
  
  
  
  
  • 3 weeks of paid time off
  
  
  • 8 observed holidays
  
  
  • Comprehensive insurance coverage
  
  
  • Employee Stock Ownership Plan (ESOP)
  
  
  • An opportunity to work on mission-critical semiconductor solutions impacting multiple industries and national security.
  
  
  • A collaborative and innovative culture with diverse and engaging projects.
  
  
  
  

Phoenix Semiconductor Corporation is an Equal Opportunity employer. All qualified applicants will receive consideration for employment without regard to race, creed, color, religion, sex, gender identity or expression, sexual orientation, national origin, age, physical or mental disability, genetic information, veteran status, occupation, marital or familial status, political opinion, personal appearance, or any other characteristic protected by applicable law. Phoenix Semiconductor Corporation is committed to promoting an innovative environment that embraces diversity, encourages creativity, and supports innovative ideas.

Join us at Phoenix Semiconductor Corporation and be part of a team shaping the future of semiconductor technology.