What are the responsibilities and job description for the Advanced Technology Integration, Package Thermal Engineer position at Advanced Micro Devices, Inc?
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
Role
In this role you will lead development of next generation of electronics packaging thermal technologies and drive integration of package and system level thermal solutions for AMD products.
Person
Ideal candidate is self-motivated, works independently, highly organized, articulate and collaborates effectively with cross-functional teams.
Responsibilities
- Thermal modeling for technology path finding and product road mapping.
- Partner with Silicon design to enable thermally optimized power and performance without compromising reliability.
- Partner with package and system architects to ensure thermally optimized end-to-end solutions.
- Partner with internal and external thermal labs for measurements and characterization.
- Manage consortium and academic research initiatives and relationships for thermal management.
- Participate in technology review with vendors.
- Set targets and directions for thermal technology development, identify technology readiness and influence AMD product roadmaps.
- Thermals subject matter expert within advanced technology integration responsible to ensure integrated thermal solutions with a focus on Data Center applications.
Experience
- Direct experience with package and system level thermal modeling & experimental characterization.
- Experience developing cooling solutions for data centers (server and rack level cooling), servers (air cooled and liquid cooled), mobile systems (laptops, notebooks) and workstations.
- Knowledge of cold plate technologies, vapor chambers, air cooled heatsinks, TIMs, immersion cooling & microfluidics, electronic packaging
- Strong understanding of heat transfer, fluid dynamics and materials science
Education
MS or PhD in relevant Engineering disciplines or physics.
Location
Austin, Texas
#LI-AP3
#LI-HYBRID
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
