What are the responsibilities and job description for the Packaging FEA Engineer position at Advanced Technology Search?
Our client is a leader in RF Power Amps, PA Front End Modules and BAW Filters for 5G Smartphone phone and WLAN applications.
They have grown incredibly from organic growth.
They are Looking for a Packaging FEA Engineer for their RF Front end products. Will be responsible for IC / MEMS Packaging, FEA Modeling, and should have a solid understanding of PCB technology, packaging materials, material interactions, processes, mechanics, and analytical techniques. Experience with Abaqus or Python script is highly preferred.
Need an MS or PhD in mechanical / civil / mechanics engineering with 5-10 years of industry experience.
Requirements :
- Advanced degree (MS, PhD) in mechanical / civil / mechanics engineering, background with material process engineering preferred
- 5-10 yr experience in IC / MEMS packaging, and finite element analysis (FEA) / modeling (FEM) in packaging area. Experience with Abaqus / Python script preferred
- Solid technical understanding of full range of PCB technology, semiconductor packaging materials, material interactions, processes, mechanics, dominant failure mechanisms and analytical techniques
- Expertise in defining device level and package level FEA projects, performing simulation using various modeling techniques and material models, and interpreting modeling results
- Skilled at building modeling infrastructure, and achieving automation for modeling construction and generating reports by writing scripts / codes
- Experienced in modeling validation by experimentally characterizing materials, measuring in-plane and out-of-plane displacements / strains, etc.
- Understanding of package qualification and reliability methods, failure analysis, statistics, control methodology is preferred
- Excellent communication skill and ability to work with cross-functional teams
J-18808-Ljbffr
