What are the responsibilities and job description for the Sr. Principal Wafer Bonding Integration Engineer position at Advanced Technology Search?
We are working on behalf of a leading maker of RF ICs and RF Front End Modules for mobile, WIFI and other fast-growing markets. They also use SAW and BAW technology for RF Filters. They are looking for a Sr. Principal Wafer Bonding Integration Engineer .
As the company adapts and improve its’ SAW / BAW product, your responsibility will be to provide optimal solutions for Wafer Bonding needs, which ensure a successful transfer to high volume production.
- Will promote efficiency in the process, yields, and drive best practices.
- Will be a high-level technical contributor, as well as having dotted line management responsibility across several disciplines.
- We need an advanced degree in Electrical Engineering, Material Science, or Physics, with 10 years in Semiconductor process and 8 years in Wafer Bonding.
- Experience in with Piezo-electronics, or acoustic filters is preferred. Experience in RF or MEMs is useful as well.
- Should have proven success in Wafer Bonding in a high-volume manufacturing environment.
