Packaging Engineer II

Summary:

Atomica recently had an internal R&D team spin off into it's own independent start up. We are looking for an intellectually driven individual to own the design of our next state of the art MEMS power relay package. In this role you manage all aspects of packaging from top metallization on the wafer to the finalized package. You will be responsible for identification and management of the offshore test and assembly house along with the packaging roadmap for all current and future products. This role requires working alongside device engineering team to ensure that package does not limit the performance of the die.

Responsibilities:

• Lead the advanced packaging of our 20A power relay and high-performance RF relay
• Work with the device team to own packaging development from concept to production
• Integrate design guidelines for manufacturability, leveraging packaging knowledge and working closely with the Product engineering team to assist with all package reliability and qualification.
• Interface with the Design, Product, Test, Manufacturing Engineers and OSAT
• Develop and identify new materials/equipment/qualification for assembly processes
• DOE planning, statistical process analysis, and process specification related to packaging
• Solve complex issues related to packaging approaches, design, and specifications

Requirements:

• BS or above in Engineering (Mechanical, Electrical, Materials Science, Chemistry, Physics, or similar)
• 5 years' of hands-on experience in semiconductor packaging, MEMS packaging experience is a plus
• Familiarity with supply chain for fabrication, assembly, and test.
• Proficient with MCM, SIP, Wire-bond, Flip Chip, and substrate embedded packages.
• Understanding of development flow, tools, and designing for manufacturability.
• Proficient in AutoCAD or Solidworks for mechanical design and at least one thermal analysis tool like COMSOL/ANSYS.
• Understanding of semiconductor fabrication process technologies, manufacturing processes, high volume manufacturing, and production ramp experience
• Lean and Six Sigma methodologies preferred
• US Citizen or Green card holder

You will succeed in this role if you are:

• Intellectually curious and eager to change the world of power relays.
• A team player
• Excited about disruptive technologies that challenge the status quo
• Can build relationships and understand multi-cultural interactions with OSATs.

What Atomica Offers You:

• Amazing growth and learning opportunities in MEMS
• Competitive Health, Vision, Dental Insurance
• 401(k) and Roth 401(k) plan with company match
• Continuing education opportunities
• Paid Time Off
• Flexible Spending Account
• Catered in-office lunches

Why work with us?

Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.

Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.

Life in Santa Barbara:

Want to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!

Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.

We have had employees move from all over the country and say life has never been better!

Compensation:

Packaging Engineer II- Senior

$100,000 - $140,000

*Atomica encourages applications from candidates at all levels where pay will be based on experience*