What are the responsibilities and job description for the Stress / Thermal / Vibration Analysts position at Aversan Inc.?
Mechanical Analyst
Aversan Inc. (www.aversan.com) is a trusted multi-service engineering and electronics manufacturing company. Aversan delivers leading-edge and reliable safety-critical electronics and software systems to the aerospace, defence, and space industries.
We are seeking a qualified Mechanical Analyst to collaborate with the lead mechanical analyst and packaging engineer in performing various structural and thermal analyses. The ideal candidate will have experience with finite-element analysis (FEA) and lumped-circuit thermal analysis to ensure the robustness and reliability of electronic products under different environmental conditions.
Location: Shelby, NC, United States
Job Type: Hybrid
Contract Type: 1-year contract
Responsibilities
Aversan Inc. (www.aversan.com) is a trusted multi-service engineering and electronics manufacturing company. Aversan delivers leading-edge and reliable safety-critical electronics and software systems to the aerospace, defence, and space industries.
We are seeking a qualified Mechanical Analyst to collaborate with the lead mechanical analyst and packaging engineer in performing various structural and thermal analyses. The ideal candidate will have experience with finite-element analysis (FEA) and lumped-circuit thermal analysis to ensure the robustness and reliability of electronic products under different environmental conditions.
Location: Shelby, NC, United States
Job Type: Hybrid
Contract Type: 1-year contract
Responsibilities
- Perform lumped-circuit thermal analysis using provided power dissipation data for electronic components.
- Validate finite-element analysis (FEA) models by comparing results with FLIR/thermal image captures.
- Collaborate with the engineering team to facilitate design for manufacturability and assembly (DFMA).
- Conduct shock and vibration analysis, utilizing given component weights and worst-case shock/vibration stimuli.
- Utilize Ansys software to perform mechanical and thermal simulations.
- 5 years of experience in Ansys for finite-element analysis (FEA).
- Strong understanding of thermal management techniques for electronics packaging.
- Experience in shock and vibration analysis for electronic products.
- Ability to validate simulation models using real-world testing methods such as FLIR/thermal imaging.
- Ability to work independently and collaborate within a multidisciplinary team.
- Experience with electronics packaging and thermal simulation tools preferred
- Familiarity with design for manufacturability and assembly (DFMA) principles preferred
- Strong communication skills to effectively report analysis findings.
