Micro LED Fabrication Engineer

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications.  This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products.  (www.avicena.tech) 

About The Role

• Develop micro-LED Mass Transfer and related processes for high throughput.
• Design of Experiments for process optimization to deliver best-in-class defectivity (ppm).
• Interface with equipment/tooling design, facilities, maintenance, and wafer fab teams to build/install volume-capable equipment set for Mass Transfer.
• Enforce manufacturing diligence and good engineering practices, including the use of an engineering database for data collection, extraction, and analyses.
• Devise new and novel metrology methods, interpret data, and prepare complex data analyses and data-driven reports.
• Establish and sustain process documentation and standard operating procedures.
• Hands-on with significant portion of time spent inside the cleanroom.
• Support the scale up and transfer of technology to HVM partners.
  
  

Qualifications

• BS in Materials Science & Engineering or Mechanical Engineering.
• 5 years of related industrial experience.
• In depth knowledge of solder systems, thermal reflow, laser reflow, characterization of intermetallic films, adhesives, and the latest bonding technologies.
• Proficient with layout design software tools (e.g., Tanner L-Edit)
• Ability to identify, troubleshoot, and communicate significantly complex engineering problems.
• Metrology, automated inspection, and FA techniques.
• Comfortable with cleanroom protocols.
• Familiarity with health and safety regulations.
  
  

Preferred Qualifications

• MS in Engineering
• 10 years of related industrial experience
• Scanning Electron Microscopy.
• Optical-based metrologies.
• Design of Experiments methodologies.
• Proficient with JMP software.
• Computer modeling and simulation (optical, thermo-mechanical) desired, but not required.
• Working level knowledge of WL-CSP, Wafer Level Packaging, 2.5D packaging and 3D packaging technology desired, but not required.
• Direct experience with Micro-LED Mass Transfer technology desired, but not required.