Optical Packaging & Component Engineer

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications.  This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products.  (www.avicena.tech) 

About The Role

Develop and maintain micro-lens array production and associated package assembly:

• Work with optical designers to generate optical micro-lens array specifications.
• Select and work closely with key suppliers to optimize micro-lens array design.
• Support assembly process and tooling development.
• Run flip-chip-like process and machines
• Support development of mechanical/optomechanical test procedures and systems at component and subsystem levels.
• Troubleshoot during product bring up and analyze data to optimize yield.
• Specify and oversee component reliability and qualification testing.
• Perform Failure Mode Engineering Analysis (FMEA) as needed.
  
  

Requirements

• 5 years experience in micro-component fabrication.
• Experience with wafer level assembly processing.
• Familiarity with optical fibers, optical launch optimization and optical loss testing.
• Cleanroom process experience
• Hands-on expertise with optical modelling software (Zemax, etc.)
• M.S. degree or higher in Mechanical Engineering, Opto-Mechanical Engineering, or equivalent.
• Ability to work independently in a fast-paced startup environment, adapt, and overcome unforeseen challenges.
• Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.