What are the responsibilities and job description for the Senior Photonics/Semiconductor Packaging Engineer position at Cisco Systems, Inc.?
The application window is expected to close on: 12/24/25.
Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.
Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.
Meet The Team:You will be part of a multi-disciplinary team, including optical, mechanical, electrical, and manufacturing engineers. You will collaborate closely with Acacia's Silicon Photonics development team on new product designs and with the Product Engineering and Quality teams to ensure smooth transition of our products to Manufacturing.
Your Impact:You will play a key role in the design, development, and transfer to production of leading-edge transceivers utilizing silicon photonics and advanced DSP technology. In addition, you will:
- Implement new package designs and processes
- Work with OSATs to bring new products to volume production
- Solve technical problems encountered in product prototyping, qualification, and production
- Drive product solutions toward high-performance, high-reliability and low-cost
- BS degree with 12 years of experience, or Master's with 8 years of experience, or PhD 5 years of experience in photonics/semiconductor packaging.
- Experience with semiconductor assembly processes such as die bonding, wire-bonding and 2.5D/3D assembly.
- Experience with back-end wafer processing.
- Experience with materials characterization and failure analysis, IC packaging materials and back-end wafer-level processes.
- Experience with SiPh/PIC packaging, including mechanical, thermal, optics, and RF aspects.
- Experience working with OSATs and CMs on volume manufacturing.
- Experience with laser packaging.
- Experience with FEA software for thermal or mechanical analysis.
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