Mechanical Engineer, Electronics Packaging (Entry Level)

Cornelis Networks delivers the world’s highest performance scale-out networking solutions for AI and HPC datacenters. Our differentiated architecture seamlessly integrates hardware, software and system level technologies to maximize the efficiency of GPU, CPU and accelerator-based compute clusters at any scale. Our solutions drive breakthroughs in AI & HPC workloads, empowering our customers to push the boundaries of innovation. Backed by top-tier venture capital and strategic investors, we are committed to innovation, performance and scalability - solving the world’s most demanding computational challenges with our next-generation networking solutions.  

We are a fast-growing, forward-thinking team of architects, engineers, and business professionals with a proven track record of building successful products and companies. As a global organization, our team spans multiple U.S. states and six countries, and we continue to expand with exceptional talent in onsite, hybrid, and fully remote roles.  

Cornelis Networks is hiring a talented Entry Level Mechanical Engineer to join our team, focusing on electronics packaging for High-Performance Computing (HPC) and Artificial Intelligence (AI) systems. This is an exciting opportunity to work with cutting-edge technologies and play a crucial role in designing innovative thermal and mechanical solutions for HPC/AI systems, ensuring optimal performance and reliability.

In this role, you will collaborate with cross-functional teams, including electrical engineers, systems architects, and product designers, to develop and implement thermal management, structural integrity, and cooling solutions for high-power electronic systems.

Key Responsibilities:

• Mechanical Design & Analysis: Assist in designing, analyzing, and validating mechanical systems and components for HPC electronics packaging. Develop detailed 3D models and drawings using CAD software (SolidWorks, Creo, etc.). Perform structural and thermal simulations (FEA/CFD) to evaluate design feasibility, performance, and reliability.
• Thermal Management: Support designing and optimizing air and liquid cooling systems to manage heat dissipation in HPC environments. Work on innovative cooling solutions, including liquid cooling loops, heat sinks, and vapor chambers.
• Packaging & Integration: Collaborate on developing robust packaging solutions for electronic components, considering mechanical stresses, thermal cycling, and environmental conditions. Ensure mechanical designs comply with industry standards (e.g., EIA-310, IPC standards) and meet customer requirements for reliability and manufacturability.
• Prototyping & Testing: Participate in the development of prototypes and coordinate with manufacturing teams for assembly and testing. Conduct thermal and mechanical testing to validate designs and optimize performance.
• Cross-Disciplinary Collaboration: Collaborate with electrical engineers and PCB designers to optimize component placement, airflow, and thermal performance. Work with manufacturing and quality assurance teams to ensure the designs are scalable and meet production standards.

Preferred Qualifications

• Hands-on experience with prototype development and testing.
• Familiarity with industry standards such as EIA-310, OCP, IPC, or MIL-STD for electronics packaging.
• Basic understanding of high-performance computing systems and their specific packaging challenges.
• Experience with Python for automation, data analysis, or thermal simulations.
• Proficiency in CAD software (Creo, SolidWorks, or similar).
• Basic knowledge of FEA and CFD tools (ANSYS, FloTherm, or similar).
• Familiarity with thermal management techniques, especially in high-performance electronic systems.
• Knowledge of materials used in electronics packaging, such as metals, plastics, and thermal interface materials.
• Understanding liquid cooling systems or airflow management for electronics is a plus.
• Strong problem-solving and analytical skills.
• Excellent communication and teamwork skills.
• Detail-oriented with the ability to manage multiple tasks.

Minimum Qualifications

• Bachelor’s Degree in Mechanical Engineering or a related field.
• Experience in mechanical design, preferably in electronics packaging or thermal management.

Location: This role is based on-site at the Chesterbrook Corporate Center located in Wayne, PA. The ideal candidate must reside within a reasonable commuting distance.

We offer a competitive compensation package that includes equity, cash, and incentives, along with health and retirement benefits. Our dynamic, flexible work environment provides the opportunity to collaborate with some of the most influential names in the semiconductor industry. 

At Cornelis Networks your base salary is only one component of your comprehensive total rewards package. Your base pay will be determined by factors such as your skills, qualifications, experience, and location relative to the hiring range for the position. Depending on your role, you may also be eligible for performance-based incentives, including an annual bonus or sales incentives. 

In addition to your base pay, you’ll have access to a broad range of benefits, including medical, dental, and vision coverage, as well as disability and life insurance, a dependent care flexible spending account, accidental injury insurance, and pet insurance. We also offer generous paid holidays, 401(k) with company match, and Open Time Off (OTO) for regular full-time exempt employees. Other paid time off benefits include sick time, bonding leave, and pregnancy disability leave. 

Cornelis Networks does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. Cornelis Networks is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.