Technical Specialist - Wiresaw Wafer Slicing

Job Title: Technical Specialist - Wiresaw Wafer Slicing

Requisition Number: 66267

Corning is vital to progress – in the industries we help shape and in the world we share

.
We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and live

s.
Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our custome

rs.
Corning’s businesses are ever evolving to best serve our customers, industries, and consumers. Today, we accelerate and transform life sciences, mobile consumer electronics, optical communications, display, and automotive markets. We are changing the world w

ith:• Trusted products that accelerate drug discovery, development, and delivery to save l

ives• Damage-resistant cover glass to enhance the devices that keep us conne

cted• Optical fiber, wireless technologies, and connectivity solutions to carry information and ideas at the speed of l

ight• Precision glass for advanced displays to deliver richer experie

nces• Auto glass and ceramics to drive cleaner, safer, and smarter transporta

tion
Purpose of the Posi

tion:In this role, you will be responsible for providing technical leadership and expertise in diamond-coated wire (DCW) wiresaw wafer slicing process, ensuring the production of high-quality solar wafer prod

ucts.
Key Responsibili

• ties: Serve as the primary technical expert resource for wiresaw wafer slicing processes, including parameter optimization, wire selection, and maintenance, to ensure the production of high-quality w
• afers.Identify opportunities for process optimization to improve yield, reduce costs, and enhance overall efficiency in wiresaw wafer slicing opera
• tions.Develop and implement robust quality control measures to ensure the highest standards of wafer quality are maintained, including thickness uniformity, surface roughness, and defect de
• nsity.Lead efforts to troubleshoot technical issues related to wiresaw slicing, identify root causes, and implement corrective actions to address process deviations and improve process reliab
• ility.Provide technical training and mentorship to engineering and manufacturing personnel to enhance their skills and knowledge in wiresaw slicing processes and techn

iques.
Required Education, Skills and Expe

• rience:Bachelor's degree or higher in engineering, materials science, or a related
• field.10 years of experience in Solar or Semiconductor wafer manufacturing or a closely related field, with a proven track record of technical leadership and exp
• ertise.In-depth knowledge of solar or semiconductor wafer manufacturing processes, equipment, and mat
• erials.Strong analytical and problem-solving skills, with the ability to identify root causes of technical issues and implement effective sol

utions.
Desired

• Skills:Stay informed about emerging technologies and advancements in wiresaw slicing techniques, equipment, and materials, and evaluate their potential impact on process performance and product
• quality.Collaborate closely with R&D, engineering, operations, and quality assurance teams to drive cross-functional initiatives and resolve technical challenges related to wiresaw
• slicing.Maintain accurate documentation of wiresaw slicing processes, procedures, and technical specifications, and prepare comprehensive reports to communicate findings, recommendations, and project updates to stake
• holders.General awareness and ability to run basic statistical analysis, process optimization techniques, and data analysi
• s tools.Working knowledge of Design of Experiments (DOE and Statistical Process Control (SPC)

methods.
This position supports immigration spo

nsorship.
The range for this position is $106,331.00 - $146,206.00 assuming full time status. Starting pay for the successful applicant is dependent on a variety of job-related factors, including but not limited to geographic location, market demands, experience, training, and education. The benefits available for this position are dependent on hours worked and may include medical, dental, vision, 401(k) plan, pension plan, life insurance coverage, disability benefits

, and PTO.
​Corning Puts

YOU First! We are committed to supporting your health, financial, career development, and life goals as you grow professionally and personally to achieve your highest potential. All benefits begin as soon as you start your career

• at Corning.
  Our monetary peer-to-peer recognition program is tied to our Values and celebrates you and your colleagues’ co
• ntributions.Health and well-being benefits include medical, dental, vision, paid parental leave, mental health/substance use, fitness, and disease manageme
• nt programs.Financial benefits include a 401(k) savings plan with company matching contributions and a 100% company-paid pension benefit that grows steadily throughout
• your career.Companywide bonus and attractive short- and long-term compensation programs are available based on your role and respo
• nsibilities.Professional development programs help you grow and achieve your c

areer goals.
We prohibit discrimination on the basis of race, color, gender, age, religion, national origin, sexual orientation, gender identity or expression, disability, veteran status or any other legally prot

ected status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. To request an accommodation, please contact us at accommodation