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Senior Staff Packaging Engineer

Cyfle
San Jose, CA Full Time
POSTED ON 3/2/2025
AVAILABLE BEFORE 5/25/2025

About the job Senior Staff Packaging Engineer

Salary : $ 170,000.00

We have partnered with a semiconductor manufacturing firm in the San Jose, CA area to provide them with a Senior Staff Packaging Engineer. Please review the below description and let us know if you are interested.

Prioritized Must Have Skills for the Senior Staff Packaging Engineer :

1. Minimum of 12 years experience in semiconductor packaging technology.

2. Experience leading multi-die packages.

3. Organic laminate technologies manufacturing and supplier capabilities.

Responsibilities of the Senior Staff Packaging Engineer :

  • Responsible for defining substrate / package design rules, process flow and material set for new automotive power module packages
  • Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
  • Develop new assembly technologies, run process DOEs, to define process windows for new package development
  • Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
  • Work closely with offshore assembly and substrate partners to develop new processes
  • Work closely with IC design teams to define package design rules and define packages to meet their requirements
  • Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products

Requirements of the Senior Staff Packaging Engineer :

  • BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
  • Minimum experience 12 years in semiconductor packaging technology.
  • Experience leaded multi-die packages.
  • Understanding of organic laminate technologies manufacturing and supplier capabilities.
  • Experience in SMT or passive integrated package assembly is a plus.
  • Experience with packaging processes : Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
  • Experience with package substrate design rules, tools (including AutoCAD).
  • Knowledge of AEQ Automotive reliability requirements.
  • Knowledge of APQP automotive development process
  • Knowledge of JEDEC / IPC design standards.
  • Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
  • Travel to Asia to attend technology reviews and resolve subcon / supplier issues

    • Other Key Requirements :

  • 100% in office
  • Must be able to travel to Asia.
  • No sponsorship or Visa holders. No Corp-to-Corp.

    • Benefits of the Senior Staff Packaging Engineer :

  • Medical Insurance
  • Dental Insurance
  • Vision Insurance
  • Short- & Long-Term Disability Insurance
  • 401(k) Plan

    • About the Company :

    Cyfle is a global business dedicated to connecting talents worldwide. Our comprehensive RPO services, placement services, and training services help businesses unlock their full potential.

    Salary : $170,000

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