What are the responsibilities and job description for the Electronic Engineering position at Foxconn Assembly LLC?
Purpose of the Position
The Electronics Engineer for Server Hardware is responsible for working with customers and cross-functional teams to develop Server/Storage electrical specifications and designs. In close collaboration with the Program Manager, Mechanical Engineer, Thermal Engineer, Signal Integrity Test Group, BIOS, BMC, and PCB Layout teams, the role involves driving the development and full testing of server products from early development to production. A strong team player, the Electronics Engineer must be capable of working across multiple departments to ensure the successful delivery of products.
Duties and Responsibilities
Collaborate with cross-functional teams (e.g., EE, BIOS, BMC, PA, SI) to develop and deliver a successful server product to market.
Apply knowledge of Signal Integrity, including eye diagrams, transmission lines, and EMI, both theoretically and practically.
Possess in-depth knowledge of Intel server motherboards (MB) and x86 architecture.
Have expertise in Multi-phase VRM, high-speed signals (USB/SATA/SAS/QPI), and DDR4/DDR3 memory technologies.
Utilize Cadence OrCAD/HDL and Allegro for specification development, design, schematic capture, layout checking, BOM generation, system-level debugging, and testing.
Drive the resolution of customer-reported system issues in a timely manner.
Ensure compliance with Design for Manufacture (DFM) principles and implement effective EMC mitigation techniques.
Education and Work Experience
MS/BS in Electronics Engineering (EE) or Computer Engineering (CE) with 0-3 years of relevant experience.
Proven experience in schematic design, PCB layout activities, and familiarity with PCB CAD design tools, preferably Cadence.
Hands-on experience with prototype assembly, including fine-pitch soldering.
Strong understanding of Design for Manufacture (DFM) concepts and EMC mitigation methods.
Demonstrated ability to optimize electronic designs while minimizing cost and enhancing efficiency.
Familiarity with a broad range of electronic test equipment for validation and troubleshooting.
Knowledge of IPC standards and electronics manufacturing methods is desirable.
Skills and Competencies
Strong problem-solving and troubleshooting skills, with the ability to evaluate the long-term implications and consequences of solutions (e.g., impact on component life due to electrical or thermal stress).
Ability to work both independently and as part of a team, contributing insights and solutions to project decisions.
Strong verbal and written communication skills for sharing ideas, updates, and technical information with other teams and customers.
Additional Information
Work Environment: Office-based role in a fast-paced environment.
Travel: Approximately 15%, including potential international travel. A valid passport (or the ability to obtain one) is required.
Background Check: This role may require a background check to verify engineering certification.
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