Product Engineer

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Product Engineer to design and develop printed circuit board assemblies and optimize manufacturing processes. Once a part of the team, you will be responsible for a wide variety of tasks within the GL6 Product Engineering Department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing.

The Product Engineer will manage new product introductions, coordinate with customers on technical requirements, and lead continuous improvement initiatives to enhance quality, cost, and delivery performance.

Job Responsibilities:

• Review and optimize customer PCB designs for manufacturability, including layout analysis, component placement optimization, and DFX (Design for Excellence) recommendations to ensure efficient production
• Lead New Product Introduction (NPI) activities and project management, coordinating timelines, resources, and deliverables while managing technical documentation and customer requirements
• Develop and maintain detailed manufacturing processes and documentation, including work instructions, process flows, and quality control parameters for PCB assembly operations
• Manage engineering changes and Bill of Materials in SAP, ensuring accurate product data management and change control procedures while maintaining revision history
• Coordinate with cross-functional teams (Production, Quality, Supply Chain) for successful product launches, facilitating communication and resolving technical challenges
• Support quality initiatives including PPAP (Production Part Approval Process) and PFMEA (Process Failure Mode and Effects Analysis), developing control plans and implementing preventive measures
• Troubleshoot production issues and implement corrective actions, conducting root cause analysis and developing solutions for assembly, testing, and quality concerns
• Procure and manage tooling and fixtures for manufacturing, including specification development, vendor selection, and maintenance planning
• Other duties as assigned
  
  

Qualifications:

• Bachelor's degree in Electrical/Mechanical Engineering required
• 3 years experience in PCB assembly processes and methodologies required
• Experience with SMT, through-hole, and other PCB assembly techniques preferred
• Must be able to lift up to 50 pounds and stand/walk for extended periods
  
  

Reasons you should work for us:

• Comprehensive benefits package including medical, dental, and vision insurance coverage
• Basic life insurance and short-term disability coverage provided by employer
• Supplemental life insurance and long-term disability coverage options available
• 401K with employer contribution
• Personal, Vacation, and Holiday paid time off for all full-time employees
• Onsite Aurora Health & Wellness Center available for all employees
• Employees are continuously encouraged to learn and grow their careers in smart manufacturing
  
  

About FII USA, Inc., a Foxconn Technology Group Company:

FII USA, Inc, a Foxconn Technology Group Company, is a global leader in smart manufacturing and industrial internet services. With a strong presence in the digital economy, we offer a comprehensive range of solutions in cloud computing, industrial internet, smart home, 5G, and network communication equipment. Fueled by continuous innovation and a commitment to sustainable development, we have become a key player in the electronic manufacturing service industry and sit at the forefront of driving advanced industry development.

FII USA, Inc is an Equal Opportunity employer. All qualified applicants will receive consideration for employment, without regard to sex, race, color, religion, national origin, age, marital status, political affiliation, sexual orientation, gender identity, genetic information, disability or protected veteran status. We are committed to providing a workplace free of any discrimination or harassment.

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