What are the responsibilities and job description for the Future Customer Experience Mechanical/Thermal Engineer position at HP Development Company, L.P.?
Future Customer Experience Mechanical / Thermal Engineer
Description -
HP is the world's leading computer systems and printing company, we create technology that makes life better for everyone, everywhere. Our innovation springs from a team of individuals, each collaborating and contributing their own perspectives, knowledge, and experience to advance the way the world works and lives. We also create products and solution that help people connect and communicate more effectively regardless of locations and device. We are looking for visionaries, like you, who are ready to make a purposeful impact on the way the world works. At HP, the future is yours to create!
HP Poly organization, innovation is at the heart of everything we do. We believe that one thoughtful idea has the power to change the world. The business unit, Future Customer Experiences team, is to deliver the future of hybrid work with new-to-the-world solutions. We commit to this charter and will be diligently partnering with our teammates on the NPD product and engineering teams to plan the right release vehicles to get our future innovations to market.
This role will support to design current and next generation innovative FCE hardware and solutions.
This position is based in Fort Collins, Colorado, USA. 5 days a week in the office with flexibility to work from home as appropriate. The team is split between the USA and Taiwan.
Travel is expected for this position and fluctuates throughout project cycles. It will be a mix between international and domestic, averaging 1-2 trips per quarter.
If you are our Future Customer Experience Mechanical Hardware engineer, you will conduct following activities on your job :
- Designs engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines.
- Leads a project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for complex products.
- Designs and develops mechanical and electromechanical solutions to complex problems
- Conducts structural and thermal analyses, including finite element analysis (FEA), computational fluid dynamics (CFD), and thermal modelling to optimize system performance
- Research, evaluates, and implements new materials and technologies for thermal management solutions
- Develops small to large (wearable to 70in display) consumer-product like mechanical designs
- Work cross-functionally with electrical, optical, compute, acoustic, and other teams with HP
- Works with suppliers and partners around the globe to ensure products meet HP requirements.
- Develops and implements test plan and criteria for new and existing designs, including validation of thermal performance, tolerances, form / fit / function, shock and vibration, electromagnetic interference, safety, reliability, system power measurements & acoustics.
- Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.
- Represents the mechanical / thermal team for all phases of larger and more-complex development projects.
- Provides guidance and mentoring to less- experienced staff members.
- Reviews and evaluates designs and project activities for compliance with technology and development guidelines and industry standards; provides tangible feedback to improve product quality
- Engagement with R&D technologists
- Routinely exercises independent judgment in developing criteria for achieving objectives
Are you a high-performer? We are looking for an individual with :
Integrity
Education & Experience Recommended
Preferred Certifications
Knowledge & Skills
Cross-Org Skills
Impact & Scope
Complexity
Disclaimer
The base pay range for this role is $80,000 to $115,000 annually with additional opportunities for pay in the form of bonus and / or equity (applies to US candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits :
HP offers a comprehensive benefits package for this position, including :
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job Posting Expiration Date : 2 / 28 / 2025
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
If you'd like more information about HP's EEO Policy or your EEO rights as an applicant under the law, please click here : Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law - Supplement
Salary : $80,000 - $115,000
