What are the responsibilities and job description for the Advanced Packaging Engineer - Staff position at InvenSense?
Job Description
Work within MEMS Core Technology Team providing leadership in the areas of package design, and package assembly development for Technology development and new product introduction. The scope of work includes definition of package requirements through package design, collaborating on package modelling & simulation, ensuring the product conforms to engineering design intent, assembling prototypes for proof-of-concept demonstration and championing the new product introduction (NPI) thru scale up and mass production. The job will involve close interaction with cross-functional teams across the company, overseas manufacturing houses (OSATs) as well as close interactions with internal customers.
Job Qualifications :
- MS or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, Physics, or similar discipline
- Broad materials knowledge and 5 years of assembly process development experience in microelectronics
- Knowledge of semiconductor assembly processes eg. dicing, die-attach, die stacking with thin die, flip-chip, wire-bond, underfill, molding, RDL.
- Expertise in problem-solving / troubleshooting package solutions within complex multidomain microsystems.
- 5 years of hands-on work experience with WLCSP, QFN, LGA, or flip-chip packages.
- 5 years of work experience in supplier / OSAT management, NPI, and mass production
- MEMS package and substrate design and build experience
- Demonstrated ability to work effectively in a geographically distributed team
- Strong written & verbal communication skills and excellent presentation skills
- Familiarity with FEM package simulation (EX : ANSYS, COMSOL etc), package co-design and risk assessments
- Working knowledge of statistical process control and statistical tolerance analyses
- Knowledge of MEMS is a plus (e.g. accelerometers, gyroscopes, microphones, and magnetometers)
- Ability to work in a fast-paced environment
- Ability to travel internationally when needed
InvenSense, a TDK group company, is a world-leading provider of MEMS and magnetic sensor solutions found in mobile, wearable, smart home, AR / VR, and other consumer and IoT applications. We are innovators with a 20 year history of patented sensor technologies. As experts in our field, we lead industry breakthroughs in consumer, industrial and automotive technology and reliably deliver high-quality solutions to our partners across global markets. Learn more about us at invensense.tdk.com.
The starting annual base pay for this role ranges between USD $145,000.00 and $200,000.00 . The actual base pay is dependent on various factors, including training, transferable skills, work experience, business needs, and market conditions. This range is subject to change and may be adjusted in the future.
This position is open to candidates based in San Jose, CA with a hybrid work requirement (on-site presence required). The role is also eligible for variable bonus programs and benefits.
Salary : $145,000 - $200,000