Advanced Packaging Research Engineer

Lensa is the leading career site for job seekers at every stage of their career. Our client, IBM, is seeking professionals in Albany, NY. Apply via Lensa today!

Introduction

IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make.

Your Role And Responsibilities

Developers and Engineers at IBM Research play a pivotal role in advancing innovation by overseeing the design, construction, testing, and characterization of both hardware and software. This multifaceted responsibility spans from individual devices to system-level implementations. Our team is dedicated to enabling and supporting internal research initiatives, evaluating emerging technologies for their potential application in real-world products, and demonstrating the value of these technologies for IBM's businesses and strategic partners.

Key Responsibilities Include

• Research-Driven Development: Drive the development process in alignment with internal research goals, ensuring that the hardware and software solutions meet the unique requirements of our research endeavors.
• Emerging Technology Evaluation: Evaluate emerging technologies to discern their suitability for real-world product applications, conducting thorough assessments to inform decision-making.
• Demonstrating Technological Value: Showcase the value of developed technologies by conducting demonstrations that highlight their potential impact on IBM's businesses and collaborations with partners.
• End-to-End Expertise: Bring expertise across the entire development spectrum, from individual device intricacies to comprehensive system-level architecture, ensuring a holistic approach to solution building.
• Collaboration and Integration: Collaborate effectively with interdisciplinary teams, integrating hardware and software components seamlessly to create robust and innovative solutions.
• Adaptability and Innovation: Embrace adaptability and a forward-thinking mindset, staying attuned to technological advancements and incorporating innovative practices into the development lifecycle.
  
  

IBM’s Research Division is looking for an experienced bonding & assembly engineer with knowledge on wafer-level molding, laminate, reliability, and failure analysis to support the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York.

The engineer would be part of a multi-disciplinary, multi-cultural, research and development center that brings together advanced logic technologies nodes with next generation semiconductor packaging technologies

Required Technical And Professional Expertise

• More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,
• Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
• Ability to drive joint development with tooling/material supplier,
• Positive and self-motivated and excellent presentation skills,
• Ability to work in a team environment and to debug errors and solve problems.
  
  

Preferred Technical And Professional Experience

• Hands on experience in semiconductor 3D packaging technology,
• More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
• Experience w/ design of experiments, process controls, and statistical data analysis,