What are the responsibilities and job description for the Manufacturing Technician - Wire Bonding position at Microchip Technology?
Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.
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Job Description:
We are seeking a detail-oriented and technically skilled Manufacturing Technician - Wire Bonder to join our Discrete Products Group (DPG) component manufacturing department. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes. You will play a crucial role in the production of our high-quality electronic components, ensuring that our products meet the highest standards.
ESSENTIAL DUTIES AND JOB RESPONSIBILITIES include the following.
- Operate wire bonding machines and equipment with precision and according to standard operating procedures.
- Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
- Inspect and test wire bonds to ensure quality and compliance with specifications.
- Perform wire bond equipment setup including tool changes, wire changes, and
- Troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
- Maintain accurate records of production data, process adjustments, and equipment maintenance.
- Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
- Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
- Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
- Assist in the training of new technicians and support staff as required
- Perform other tasks and assist with various projects as needed.
- Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
- Good interpersonal, teaming and communication skills
Requirements/Qualifications:
- Ability to multi-task while paying careful attention to detail
- Prior success working both individually and in a team environment
- Good written and verbal communication skills
- Ability to follow written and verbal direction
- Ability to read, comprehend and follow detailed work specifications
- Excellent listening skills
- Adaptability to frequent change and improvements
- Regular and predictable attendance is essential
- Ability to wear the required Protective Equipment
- Basic computer, math and reading comprehension skills
- You must be 18 years old with a high school diploma or GED
Required Qualifications:
- High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
- Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
- Proficiency with automated wire bonding machinery and manual wire bonding techniques.
- Strong understanding of microelectronics and the ability to work with delicate components.
- Ability to read and interpret technical drawings and process specifications.
- Excellent manual dexterity and hand-eye coordination
- Excellent visual capability to work with extremely small die, without magnification devices.
- Experience using tweezers, vacuum pencils, etc.
- Strong problem-solving skills and attention to detail.
- Ability to work in a fast-paced, team-oriented environment.
- Good communication skills, both written and verbal.
Travel Time:
0% - 25%
Physical Attributes:
Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Stooping, Talking, Works Alone, Works Around Others
Physical Requirements:
Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.
Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the
For more information on applicable equal employment regulations, please refer to the
EEO is the Law Poster
and the EEO is the Law Poster Supplement
. Please also refer to the Pay Transparency Policy Statement
.
To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.
