What are the responsibilities and job description for the Snr Manager, HIG-HBM Product Engineering position at MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD?
As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time.
You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction.
You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM is exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.
Key Responsibilities :
- Reliability Test Flow Development : Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
- Reliability Test Plan and Execution : Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
- DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time.
- Root Cause and Resolution of Qual and RMA Device Issues : Debug and identify root cause and failures in reliability tests by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
- Process Conversions and HVM : Provide recommendation to fab teams for new process conversions to reduce cost and increase yields, impacting yield, quality, reliability, and performance of HBM products.
- Risk Management : Communicate with Product Managers / Leads to manage risks associated with DPM process conversions, balancing innovation with stability and reliability.
- Promotion of Innovation : Promote innovation and drive for changes that will provide Micron with a technical advantage over its competition.
- Mentorship and Development of Others : Actively develop and mentor others for the growth of the team and organization.
- Project Management : Develop project management skills within the team for efficient execution of projects, leading to timely delivery of technological solutions.
- Technical Decision Making : Make final decisions on risk analysis and project prioritization impacting technological development.
- Cross-Functional Collaboration : Collaborate with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality / Reliability team.
As the team manager, additional responsibilities :
Requirements :
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