What are the responsibilities and job description for the MTS/SMTS/DMTS - Advanced Packaging Integration position at Micron Technology?
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Are you seeking an intellectually stimulating role? We are seeking someone to help lead Micron’s Advanced Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs. Additionally we aim in meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost! We collaborate with Micron’s multi-functional team which includes Product Development, 3DI wafer level process, Assembly, Test, Manufacturing and Global Quality. We directly interact with senior executives on the Development and Certification Strategy of 2.5D/3D, Flip Chip and Stacked Die Wire bonded Packages. Together, we will be responsible for crafting the Test Vehicle Development Strategy, and execution to definition, development, and delivery of innovative product/packages that will craft the future of sophisticated computing!
Responsibilities
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Are you seeking an intellectually stimulating role? We are seeking someone to help lead Micron’s Advanced Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs. Additionally we aim in meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost! We collaborate with Micron’s multi-functional team which includes Product Development, 3DI wafer level process, Assembly, Test, Manufacturing and Global Quality. We directly interact with senior executives on the Development and Certification Strategy of 2.5D/3D, Flip Chip and Stacked Die Wire bonded Packages. Together, we will be responsible for crafting the Test Vehicle Development Strategy, and execution to definition, development, and delivery of innovative product/packages that will craft the future of sophisticated computing!
Responsibilities
- Build the Establish Project Program (EPP) documents for 2.5D/3D packages.
- Drive technology integration activities for the test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
- Coordinate core team in Development and NPI space of advanced 2.5D/3D packages to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
- Interface closely with multi-functional team and lead the product/package to mass production.
- Support and collaborate with customers to ensure that Micron’s products can meet their quality, reliability, system, and operational needs.
- A Masters or Ph.D. in an Engineering Subject area - Electrical Engineering, Computer Engineering, Chemical Engineering, Materials Science & Engineering.
- 7 years of experience in interpreting die, package, & system level design & simulation (thermal/mechanical/electrical) methodologies and results.
- 3 years of experience communicating sophisticated technical concepts to both Sr. Leadership & Executives.
- Problem Solver
- 3 years Experience with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
- 7 years Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
