What are the responsibilities and job description for the 3D Heterogeneous Integration Development Engineer position at Micross?
Primary responsibilities of this member of the engineering staff are to support Program Managers and technology development projects in the form of day-to-day project management to ensure customer deliverables and internal development project deliverables are successful and remain on schedule. The position responsibilities include process development, building process flows & lot travelers, lot management & engineering support, as well as providing budgetary input on bids / proposals, and technical support for Program Managers on large proposals. Duties may include development of photolithographic processing, wet processing, dry etching, thin film deposition, electroplating, and die assembly processes. The position may also require performing mask design & layout, electrical testing, and other forms of material & process characterization. The successful candidate will have a strong background in back-end-of-the-line (BEOL) semiconductor processing (e.g. MEMS or other post-CMOS processing). Experience in advanced packaging and / or 3D integration processes is desired.
Essential Duties & Responsibilities :
- Development engineers have most of the project engineering responsibility and visibility for day-to-day deliverable schedules.
- May include solving high level engineering problems independently or with help from Program Managers, or other Development Engineers
- May be asked to write papers, give presentations, support or prepare proposals, or contribute to quotes
- Participate in or lead customer meetings, and in some cases become the point of contact for customers
- Communicate daily processing needs or deliverable schedules to the Program Managers and / or Director of Operations
- Ensures adherence to their specific customer schedules and quality standards
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