What are the responsibilities and job description for the Die Attach & Wire Bond Assembler position at Micross?
Summary :
Perform duties to attach die to packages, set up and program wire bond machines, and wire bond die to packages according to build prints, complying with instructions and prescribed routines, methods or procedures and involving the making of minor decisions.
Must have strong wire bond experience with an understanding of wire bonding techniques and equipment.
Essential Duties & Responsibilities :
- Work from specifications, method sheets, diagrams, sketches, build prints, military standard procedures, and instructions.
- Verify production work order forms, build prints and materials to be used.
- Set up software on bonding machines. Set oven at proper temperature for specjfic epoxy being used. Cure epoxy.
- Attach die to package per build print.
- Plasma clean parts.
- Perform bond pull destruct tests to ensure strength and reliability.
- Bond all required parts and update wire bond logs.
- Inspect packages for compliance with requirements and perform rework as needed.
- Maintain written and practical wire bond certifications.
Other Duties & Responsibilities :
Requirements
Tools and Equipment Used :
Microscope, wire bond machines, thermocouple, and required clean room clothing.
Job Qualifications :
Job Skills :
Benefits
Medical, Dental, and Vision
401k
Company Paid Basic Life Insurance, STD, and LTD
Vacation Time
Sick Time
Holidays
Tuition Reimbursement
Pet Insurance
Legal Insurance offered through Allstate
Critical Illness, Hospitalization and Accident Insurance offered through Allstate
