What are the responsibilities and job description for the Shift Packaging and Assembly Engineer - 2nd Shift position at Micross?
This engineer will support documentation, implementation, and improving robust mechanical assembly methodology in the areas of IR scene projector arrays, detector modules, RF or Digital semiconductor electrical component and IC chips assembly and packaging in a broad range of configurations.
Essential Duties & Responsibilities :
- Develop and manage assembly processes - such as die attaching, wire bonding, underfill, flip-chip assembly process,
- Assist with development and design of advanced packaging and electromechanical fixturing for customer requirements or internal demands
- Conceive methods and processes to meet customer's prototype packaging and assembly requirements
- Develop bills of materials and operation routers for assembly projects including time studies and workflow analysis
- Support operation of semiconductor processing equipment
- Drive cost reduction and yield improvement projects
Job Qualifications :
Other Duties & Responsibilities :
Other Job Skills :
Benefits :
At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.
Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.
www.Micross.com
