Microelectronics Engineer - Entry to Experienced Level (Maryland)

Summary As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise, administer and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles. Responsibilities With the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission. Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission. The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions : Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer. 1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and / or system enclosures. Areas of responsibility can also include : - Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design - Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL - Knowledge of Digital / Analog Logic design / simulation, functional verification, Design For Test (DFT), testability analysis - Understanding and development of assembly specifications in accordance with industry standards - Understanding and application of Signal Integrity (SI) / Power Integrity (PI) / Electro-Magnetic Integrity (EMI) Analysis methodologies for design - Conduct research including studies, experiments, and investigations on new or alternate methodologies - Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics 2. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and / or system enclosures. Areas of responsibility can also include : - Participate in assembly and fabrication process improvement efforts - Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and / or assembly equipment - Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics 3. A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and / or system enclosures. Areas of responsibility can also include : - Conduct environmental and reliability tests - High-pin-count Integrated Circuit (IC) design and operation validation - Parametric testing - Accelerated testing / qualification / screening - Develop test plans according to industry and military specifications - Design and develop test platforms - Support quality assurance efforts for developed and fielded systems - Disassembly and sample preparation for physical analysis of ICs for failure analysis - Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and / or atomic force microscopy (AFM) When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application. Please do NOT populate the resume tool with - see resume. Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the position's coursework obligations have been met. Requirements Conditions of Employment Qualifications The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology) For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.

• Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas : (a) statics or dynamics, (b) strength of materials / stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials / relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics. FOR MICROELECTRONICS PACKAGE DESIGN ENGINEER : SENIOR Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered. Relevant experience must be in one or more of the following : developing advanced microelectronics systems through the design of integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures using electronic design automation (EDA) tools. FOR MICROELECTRONICS PROCESS ENGINEER : Relevant experience must be in one or more of the following : assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures. FULL PERFORMANCE With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience. SENIOR Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered. FOR MICROELECTRONICS TECHNOLOGY ENGINEER : ENTRY With a professional Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience. Relevant experience must be in one or more of the following : assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures. FULL PERFORMANCE With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience. Relevant experience must be in one or more of the following : characterization, test, reliability, or failure root cause analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures. Education The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology) For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.
• Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas : (a) statics or dynamics, (b) strength of materials / stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials / relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics. Additional Information Pay : Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager / organization regarding the work level for the position. Salary Range : $86,498 - $190,848 (Entry, Full Performance, Senior) Salary range varies by location, work level, and relevant experience to the position. On the job training, internal NSA courses, and external training will be made available based on the need and experience of the selectee. Benefits : NSA offers excellent benefits to include relocation assistance, flexible work schedules, generous leave programs, paid personal fitness time, training and continuing education classes, health and life insurance, Federal Thrift Savings Plan (TSP), and a Federal retirement plan. Work Schedule : This is a full-time position, Monday - Friday, with basic 8 hr / day work requirement between 6 : 00 a.m. and 6 : 00 p.m. (flexible).

Salary : $86,498 - $190,848