Packaging Engineering Manager

About Us:

nEye Systems is an optical switch startup founded in 2020 to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability. www.neye.ai.

Job Overview:

As a Packaging Engineering Manager at nEye, you will lead the strategic development and execution of advanced packaging technologies for our silicon photonics-based MEMS optical circuit switch (OCS) products. You will oversee packaging design initiatives and serve as the technical and operational leader, collaborating cross-functionally with internal design teams, OSAT partners, and third-party vendors. This is a high-impact role responsible for scaling packaging solutions from early-stage development through high-volume production.

Key Responsibilities:

• Packaging Design and Development: Design and develop packaging technologies for implementation in our OCS, including mechanical aspects of packaging technology and associated material and process interactions
• Team Lead: Manage a team of Packaging Engineers and drive milestones and deliverables of packaging activities for our OCS from product development to production release
• Packaging Implementation and Activities: Work with the internal nEye team, OSAT partners, and 3rd party suppliers for design reviews and execution to implement packaging technologies for our OCS
• Milestones and Deliverables: Drive the timely delivery of packaging activities for our OCS from product development to production release
• Identify Risks and Drive Solutions: Lead company activities to identify and address potential risks and challenges in packaging our OCS
• Documentation: Create and maintain comprehensive documentation of procedures, results, and engagements
  
  
  

Minimum Qualifications:

• Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Photonics, Materials, or a related field
• 8 years hands-on experience in semiconductor packaging assembly processes wafer bonding, die attach, wire-bonding, materials, etc., with 3 years of people management experience
• Strong background in packaging technologies, structures, materials, and processes
• Demonstrated experience mentoring and developing technical teams
• Strong leadership, interpersonal, and stakeholder management skills, with the ability to influence cross-functional teams and external partners
• Experience with IC packaging modeling & simulation and packaging failure analysis
• Proficiency in using test equipment such as optical spectrum analyzers, power meters, and network analyzers
• Excellent analytical and problem-solving skills
• Thrive in a fast-paced environment; can participate in multiple work streams simultaneously; are passionate about solving problems and learning
  
  
  

Preferred Skills:

• Experience with the design and fabrication of MEMS structures and optoelectronic devices
• Understanding of industry standards for MEMS chip packaging
• Experience in optical packaging, co-packaged optics, and hybrid bonding
• Experience in design and fabrication of devices with both micro- and nano-scale features
  
  
  

Benefits & Perks:

• Opportunity to join a small, well-funded start-up company that is doing pioneering work in optical switches
• Competitive salary and equity package, including early-stage company stock options
• 401k
• Full healthcare coverage: medical, dental, and vision
• Fitness center access
  
  
  

Equal Opportunity Employer. All qualified applicants will receive consideration for employment at nEye Systems without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.

Starting salary will depend on relevant experience, skills, training and education, market demands, and the ultimate job duties and requirements.