Advance Packaging Engineer

Job Description

Job Description

Full Time or Part Time :

• Full Time

Pay Rate : Location :

• Kissimmee, FL, 34744

Language Requirements :

• Speak, write, and read English at a professional level

Language Preferences :

• N / A

Job Overview :

We are seeking a hardworking and passionate Assembly and Packaging Engineer to lead the development and improvement of advanced assembly processes for various applications, including Fan-Out Wafer Level Packaging (FOWLP) and interposers. Responsibilities will include collaborating effectively with foundry customers and colleagues and overseeing process development in areas such as wafer back-end manufacturing, die singulation, wire bonding, and final PCB laminate assembly. A strong technical background in semiconductor device packaging, along with knowledge of high-density interconnect technologies, is preferred. Excellent oral and written communication skills are essential for effectively conveying ideas and solutions within a dynamic environment. Other duties as assigned. Percentages of time spent on job duties are estimates and may vary.

Experience Requirements :

• Must be subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as a U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.
• A minimum of 5 years of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out.
• A minimum of three (3) years of supervisory experience in a health or social services program, with experience directing a senior care program
• Experience working in a manufacturing and / or cleanroom environment.
• Experience working and developing processes on manufacturing equipment.
• Experience with project management tools, such as Gantt charts, to plan and communicate project and development status.
• Knowledge of reliability test methods and qualification procedures.
• Experience with wire bonding, hermetic sealing, automatic pick and place, flip chip assembly and solder reflow.
• Proficiency in material and package characterization data analysis, and statistical data analysis.
• Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.
• Can work both independently and in (or lead) cross-functional teams for problem-solving.
• Desire to work in a fast-paced, challenging, and risk-taking environment.

Experience Preferences :

• 10 years of relevant experience

Physical Requirements :

• The position may involve working at equipment or assembly stations for long periods.
• Occasionally lifting and moving equipment or materials may require some physical strength.
• Performing tasks that require fine motor skills, such as handling small components or operating machinery.
• Close visual acuity may be necessary for tasks such as inspecting components or aligning parts.

Education Requirements :

• BS Engineering, MS / PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.

Education Preferences :

• N / A

Training Schedule : Schedule :

Dress Code :

• Business Casual

Benefits :

• Competitive salary along with financial benefits
• Bonuses
• Life insurance
• 401k match
• Opportunities to purchase company stock at a discounted rate
• A comprehensive benefits package is provided to promote a healthy lifestyle, featuring benefit eligibility from day one, paid time off, paid holidays, access to an on-site fitness facility, an on-site self-serve market, and much more.

Additional Information :

Drug screening, background and reference checks are performed if required. Valid identification and reliable transportation required. We are an E-Verify employer. We will provide the Social Security Administration (SSA) and, if necessary, the Department of Homeland Security (DHS), with information from each new employee's Form I-9 to confirm work authorization. Our employees are authorized to work in the United States.