Demo

Nanofabrication Engineer

Randstad Global Capability Center
Lafayette, IN Full Time
POSTED ON 1/14/2025
AVAILABLE BEFORE 4/7/2025

Typical Day in the Role

  • Purpose of the Team : Nanofabrication engineer to support several projects related to the development and characterization of semiconductor materials and devices which enable topological qubits. This position is an opportunity to make crucial contributions to emerging quantum hardware technologies.

Hands-on experience with developing new process steps and flows for semiconductor device fabrication is required. Expertise in ebeam lithography and / or atomic layer deposition and / or gate dielectric characterization methods will be considered favorably.

  • Key projects : This role will contribute to microfabrication or nanofabrication of semiconductor materials and devices. Working with semiconductor dies, specifically handling small chips rather than whole wafers. These projects require technical skills in lithography and experience with small semiconductor components.
  • Candidate Requirements

  • Years of Experience Required : 2-4 overall years of experience in the field.
  • Degrees or certifications required : M.S. in Physics, Materials Science or an engineering discipline
  • Disqualifiers : Job hopping, particularly contracts less than six months. Lack of technical work experience relevant to the role, such as microfabrication, nanofabrication, and handling small semiconductor chips.
  • Best vs. Average :
  • Hands-on experience working with some or all of the following semiconductor device fabrication equipment / processes in a cleanroom environment : ebeam-lithography; atomic layer deposition; thin film metals deposition; Ar ion-milling.
  • Ability to follow protocols to operate sophisticated experimental equipment and to safely work with industrial solvents, acids, and bases in a cleanroom environment
  • Excellent written and oral communication skills
  • Proficiency at accurately documenting processes and protocols.
  • Strong attention to detail and good organizational skills
  • Preference may be given to candidates with the following additional qualifications :

    1) Ph.D. in Physics, Materials Science / Engineering, or Electrical Engineering

    2) Proven ability to develop new semiconductor process steps / flows leading to significantly improved device performance and / or enabling new device types.

    3) Direct experience optimizing the deposition of and characterizing the quality of thin film gate dielectrics.

  • Performance Indicators : Performance will be assessed based on ability to work fast paced environment and quality of work.
  • Top 3 Hard Skills Required Years of Experience

  • Minimum 2-3 years experience with microfabrication or nanofabrication of semiconductor materials or devices.
  • Minimum 2-3 years experience with lithography, either optical lithography or EB lithography.
  • Minimum 2-3 years experience with semiconductor dies, specifically handling small chips.
  • Hard Skills Assessments

  • Expected Dates that Hard Skills Assessments will be scheduled : ASAP
  • Hard Skills Assessment Process : The assessment process will include 1-2 rounds.
  • Required Candidate Preparation : Candidates should be ready to address standard technical questions during the assessment.
  • Design verification activities to design quality into our products. Activities include develop and execution test plans and procedures. Perform functional, stress, system, and other types of testing. Identification of test tool requirements, and participation in specification and design reviews. Must be able to execute tests with little to no supervision. Find complex bugs, root cause and track them while recording and informing others of all appropriate and relevant info.

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