What are the responsibilities and job description for the Principal Reliability/FA Engineer position at RF Pixels (acquired by Skyworks)?
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 74961
Responsibilities
We are looking for a highly skilled and experienced GaAs/Silicon Multi-Chip Module package/Assembly reliability Engineer to join New Technology Introduction (NTI) team. The successful candidate will be responsible for ensuring the reliability of MCM from design to packaging technology. This includes developing and implementing reliability tests, analyzing failure data, and collaborating with cross-functional teams to identify and mitigate potential reliability risks. The candidate will also have good understanding mechanical stress, thermal modeling analysis and surface mount process for BLR (Board Level Reliability) testing.
Required Experience And Skills
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 74961
Responsibilities
We are looking for a highly skilled and experienced GaAs/Silicon Multi-Chip Module package/Assembly reliability Engineer to join New Technology Introduction (NTI) team. The successful candidate will be responsible for ensuring the reliability of MCM from design to packaging technology. This includes developing and implementing reliability tests, analyzing failure data, and collaborating with cross-functional teams to identify and mitigate potential reliability risks. The candidate will also have good understanding mechanical stress, thermal modeling analysis and surface mount process for BLR (Board Level Reliability) testing.
Required Experience And Skills
- BS and 10 years of experience in semiconductor packaging technology
- Or MS/PhD and 6 years of experience in semiconductor packaging technology
- Technical expertise required in failure analysis, material interaction, and yield improvement.
- Knowledge of Board Level Reliability based on JEDEC, IPC is required
- Excellent communication and collaboration skills, strong problem-solving and analytical skills.
- Reliability Test Development and Execution on reliability tests for New Technology Introduced MCM IC packages.
- Design reliability test plan based on risk assessment and PFMEA (Process Failure Mode and Effect Analysis)
- Analyze failure data from reliability tests and customer returns to identify root causes of failures. Collaborate with cross-functional teams to implement corrective actions.
- Develop and maintain reliability models and simulation to predict product reliability and identify potential reliability risks.
- Good understanding in design of daisy chain unit and BLR (Board Level Reliability) testing, drop test, Thermal cycling Test, Bend test, and Vibration test to meet JEDEC/IPC or customer specific test for mobile industry.
- Experience in MCM Assembly/Package and package reliability engineering, industry standards such as JEDEC, AEC, and IPC.
- Strong understanding of Semiconductor physics and device operation, Experience with reliability test development and execution, Familiarity with failure analysis techniques (e.g. FA, Sonoscan, X-ray, SEM/EDX), Proficiency in reliability modeling and simulation tools.
- Knowledge of package layout (Cadence APD/Allegro) and PCB design tools
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
Salary : $126,500 - $241,700
