Senior Memory Test Engineer

Rochester Electronics is immediately hiring for a Senior Memory Test Engineer!

At Rochester Electronics, we create an excellent employee experience focused on value, performance, motivation, recognition, and career growth. Many companies say their employees are their most important asset. At Rochester Electronics, we mean it!

• Outstanding low-cost medical, dental, vision, and prescription drug coverage, Rochester pays 92% of the premiums on behalf of its full-time employees
• Paid time off, including vacation, sick, and holiday
• Generous match 401K program
• Tuition reimbursement
• Flexible spending account
  
  

And so much more!

For the last 40 years, Rochester Electronics, in partnership with over 70 leading semiconductor manufacturers, has provided our valued customers with a continuous source of critical semiconductors. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester can manufacture over 70,000 device types.

General Summary

Develop and support test solutions for memory semiconductor components on automated test equipment. Responsible for applicable hardware/loadboard implementation and ongoing production product support.

Responsibilities

• Lead the design, execution, and optimization of advanced test plans for memory devices. Ensure comprehensive coverage of all performance, functional, and reliability parameters.
• Analyze large sets of test data using advanced statistical tools. Interpret results, identify failure patterns, and provide actionable insights for manufacturing improvements.
• Serve as the subject matter expert in diagnosing complex memory failures and faults. Utilize advanced diagnostic equipment (e.g., high-speed oscilloscopes, logic analyzers, and other failure analysis tools) to isolate root causes.
• Conduct root cause analysis using Six Sigma and other methodologies, such as FMEA, 8D, 5 Whys, Ishikawa, BOM’s, Visual Aid, Work instruction, and control plans, and develop corrective actions; may include presentation to a Review Board.
• Drive Continuous Improvement efforts for test processes for efficiency, scalability, and accuracy; lead automation initiatives to reduce test cycle times and improve throughput.
• Mentor junior engineers and technicians, providing technical leadership and guidance in test methodology, tool utilization, and failure analysis techniques.
• Work closely with production teams to align test plans with product goals and resolve issues related to memory design and manufacturing.
• Ensure comprehensive documentation of test procedures, results, and failure analysis reports.
• Maintain compliance with industry standards (e.g., JEDEC, ISO) and company-specific quality metrics.
• Create and maintain technical documentation and generation of DCN’s.
• Assist in Out-of-Control Action Plan (OCAP) execution.
• Assist production with equipment setup/verification.
  
  

Qualifications

• Bachelor’s degree in electrical engineering or other related or equivalent discipline.
• A minimum of 5 years prior experience in electronic or memory testing, or general semiconductor manufacturing industry with a background in memory test methodologies (e.g., DRAM, NOR/NAND-Flash, EE) including Wafersort; or other equivalent combination of education and experience.
• Advanced proficiency in test automation and programming languages (e.g., Python, C , LabVIEW).
• Demonstrated knowledge of memory test equipment, including automated test equipment (ATE)-Advantest, Teradyne, Nextest, and bench instruments
• Proficiency with bench instrumentation (meters, oscilloscopes, power supplies, signal generators, curve tracer, etc.)
• Expertise in analyzing complex test data, identifying failure modes, and implementing solutions. Strong root cause analysis and troubleshooting skills for memory devices
• Demonstrable understanding of memory device design, packaging, and manufacturing processes.
• In-depth knowledge of industry standards (e.g., JEDEC, ISO) very helpful.
• Skills:
• Ability to work within a team and as an individual contributor in a fast-paced, changing environment.
• Strong verbal and written communication skills, with ability to effectively communicate at multiple levels in the organization.
• Ability to leverage and/or engage others to accomplish projects.
• Proficient with Microsoft Office® software suite.
• Ability to multitask, prioritize, and meet deadlines in timely manner.
• Strong organizational and follow-up skills, as well as attention to detail.
• Working knowledge of ISO 9001 and IATF quality system standards
• Working knowledge of JEDEC quality and reliability specifications, test methods and standards
• Working knowledge of AS9100 and AS9120 aerospace quality system standards
• Working knowledge of JESD22, MIL-PRF-38535 and MIL-STD-883 military quality standards
• Working knowledge of semiconductor component processing, including wafer fabrication, assembly and electrical testing
• Fluency in English
• Travel up to 5%, within US and international.
• As a Rochester Electronics employee, it is expected that the individual positively supports the Rochester culture, and maintains strict adherence to work policies and practices set forth within the company.
  
  

Rochester Electronics is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability status, age, veteran status, or other characteristics protected by applicable law. Rochester Electronics is committed to a culturally diverse workforce.