What are the responsibilities and job description for the Thermal Principal Engineer position at SCOPE Recruiting?
Principal Engineer – Hardware (Thermal Management)
Location: San Jose, CA (1-day hybrid onsite schedule per week)
Compensation: $260,000–$290,000 base 25% bonus RSU (flexible, based on interview
performance)
Company Overview
A leading global technology company is seeking a seasoned Principal Engineer to drive
innovation in thermal management for advanced hardware systems. The organization
places a strong emphasis on research, development, and cross-functional collaboration.
By working closely with internal teams and external partners, this company continues to
push the boundaries of networking and computing solutions.
Role Summary
This individual contributor role focuses on designing and implementing next-generation
thermal solutions for cutting-edge chip and system architectures. The Principal Engineer
will partner with diverse teams across design, operations, and supply chain to ensure
products meet rigorous performance and reliability standards. This is a strategic position
that offers the opportunity to shape current and future thermal roadmap initiatives at a
global scale.
Key Responsibilities:
1. Thermal Technology Roadmapping
- Develop and lead the system-level thermal technology roadmap in collaboration with microelectronics packaging suppliers, thermal interface material providers, and cooling solution vendors.
- Assess and implement innovative cooling strategies (e.g., advanced air, liquid, immersion) to support large-scale hardware systems.
2. Thermal Design & Analysis
- Translate experimental test data into meaningful trade-offs, optimizing thermal gradients and package design elements for next-generation devices.
- Correlate model predictions (e.g., CFD) with real-world test results to refine thermal specifications and ensure design accuracy.
3. Validation & Qualification
- Create and execute robust test plans and qualification requirements to confirm mechanical and manufacturing adaptability of thermal solutions.
- Oversee mechanical design validation for electronic assemblies, adhering to industry standards (e.g., JEDEC JESD 51).
4. Cross-Functional Collaboration
- Work closely with engineering, operations, and supply chain teams to integrate thermal management strategies from early design through production.
- Engage with original design manufacturers (ODMs) and component vendors to align testing, manufacturing, and quality protocols.
5. Thought Leadership & Research
- Publish technical papers, case studies, and presentations that highlight innovative solutions and best practices.
- Participate in industry consortia, conferences, and academic collaborations to advance the company’s position in thermal management technologies.
Minimum Requirements:
- Bachelor’s degree in Mechanical, Thermal, or Chemical Engineering (or related field).
- 15 years of hands-on experience in thermal design, simulation, and testing for electronic devices and systems.
- Proficiency in air-cooling technologies, with exposure to liquid cooling or immersion cooling methods.
- Demonstrated experience in troubleshooting and thermal validation using data acquisition systems.
Preferred Qualifications:
- Master’s or PhD in Mechanical or Chemical Engineering.
- 20 years of experience in microelectronics thermal cooling.
- Familiarity with JEDEC JESD 51 thermal testing standards.
- Knowledge of Thermal Interface Material (TIM) Thermal Conductivity testing
- procedures.
Salary : $260,000 - $290,000
