Fab Process Engineering Manager

Position Summary:  SkyWater Technology is looking for a hardworking and passionate Fab Process Engineering Manager for our Florida Advanced Packaging site. In this role you will lead and manage a group of up to 10 process engineers across multiple process unit processing areas. This team is tasked with process development and improvement for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP).    Responsibilities: Lead, Manage, and Drive continuous improvement of process capability and controls across a team of up to 10 process engineers in some or all of the following areas: Photolithography, dry etch, wet etch, electroplating (ECD), Chemical Mechanical Planarization (CMP), thin films (PVD, PECVD), wafer to wafer (W2W) bonding, die attach, compression molding, ETest and Metrology Lead an engineering team to solve complex problems and make appropriate engineering based decisions in a complex manufacturing and R&D environment Work across organizations to enable improved processes, teamwork and communicate effectively with management and stakeholders Collaborate with process integration teams to develop scalable technologies for our customers. Work in partnership with the Equipment Engineering team to drive overall equipment effectiveness (OEE) and performance to meet company KPI's Identify opportunities and drive next steps for reducing cost, complexity, variability and waste Support implementation and execution of quality systems such as ISO9001, including process and tool qualification documentation across team Resolve process excursions and drive permanent Root Cause Corrective Actions (RCCA) Work with minimal supervision, balancing competing priorities to serve the needs of the factory with your internal and external customers Guide engineers through career development at different levels of experience to improve skills Lead, manage, coach and develop direct reports; coach and mentor employees with creating individual goals as well as quarterly and annual goals Schedule regular 1:1s; complete employee year end performance reviews The job also requires performing other duties as assigned   Required Qualifications Education: B.S., M.S. or Ph.D. Degree in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant engineering discipline. Experience and/or Training: Minimum of 15 years experience in a wafer fabrication clean room environment environment 2 years of leadership and/or management experience Experience as a process/area owner for at least two relevant process areas as above within CMOS, MEMs, Photonics, Photovoltaic (PV) or Heterogenous Integration (advanced packaging) fabrication facilities Experience with application of structured problem solving methodologies (8D, 3D, Fishbone, etc.) Experience with Design of Experiments and SPC with ability to teach/lead others to gain experience in application of statistical tools to improve processes Positive interpersonal skills, highly energetic and self motivated Outstanding communication skills - both written and verbal Demonstrated ability to meet commitments and deliver results Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs. Passionate about leading teams and developing people   US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.