What are the responsibilities and job description for the Integrated Circuit (IC) Package Design and Layout Engineer position at SkyWater Technology Foundry, Inc.?
Position Summary:
SkyWater Technology is hiring an Integrated Circuit (IC) Package Design and Layout Engineer for our Florida Advanced Packaging site. The ideal candidate will have demonstrated experience in the design of advanced packages based on wafer level technologies. You will work closely with external customer design teams and SkyWater’s internal engineering team to develop and optimize designs for lowest cost, highest manufacturability, performance, and reliability. You will support SkyWater Florida initiatives in advanced assembly processes for multiple application areas, including Fan-Out Wafer Level Packaging (FOWLP), interposers and other technology platforms.
Responsibilities:
Design and layout of advanced 2.5D/3D packages based on FOWLP, interposer, and other advanced heterogeneous integration technologies.
Work directly with customers to support PDK distribution, package layout, and design rule check/verification.
Create and maintain design rules and design methodologies.
Development and preparation of detailed drawings for customers, such as package outline drawings, and detailed drawings for IC packaging designs.
Work with vendors to accept, manage, and modify PDKs (as needed) for our standard platform offerings.
Train customers on use of PDKs for their own designs and provide customer support.
Coordinate mask acquisition for fab photolithography tools as needed.
The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications:
Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent. A commensurate combination of degree and experience will be considered.
3 years of experience in physical design and IC package Layout related to WLCSP, FOWLP and/or flip chip packaging technologies(other relevant IC package, PCB, or IC layout/design experience may also be considered).
Proficient in geometric dimensioning and tolerancing.
Knowledge of wafer level package assembly and manufacturing processes.
Signal Integrity knowledge and experience is an added advantage.
Proficient in Cadence APD, AutoCAD, Siemens Calibre or similar/equivalent EDA systems and the management of PDKs.
Can work both independently and in cross-functional teams for problem solving.
Excellent oral and written communication skills in English and Microsoft Office applications (Excel, Word, PowerPoint) are required to communicate ideas effectively and efficiently with customers, colleagues, and management.
US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Location:
This is a full-time permanent position ideally based in the SkyWater Florida office, though consideration will be given to remote location.
