Process Development Engineer

Position Summary: We are looking for a hardworking and passionate Process Development Engineer for our Florida Advanced Packaging site. In this role you will develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.   Responsibilities: • New process development/transfer/integration/ownership in a manufacturing environment. • Develop or integrate robust manufacturable process recipes for Foundry customers in one or more of the following areas: PVD, CVD, electroplating Cu and/or Au, dry or wet etch, electrical test, metrology, photolithography, wafer bonding or CMP. • Work on a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. • Utilize metrology tools to characterize and document process results for transfer to production. • Investigate and drive integration changes for improved device performance and yield improvement. • Work with process integration and tool engineers to find processing marginalities and make improvements. • Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes. • Monitor and improve electrical test parametrics through feedback and improvement of your processes. • Could develop into a Project Management position integrating Customer device requests.   The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.   Required Qualifications:   Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.   Experience and Skills: • Back-end-of-line (BEOL) or front-end-of-line (FEOL) Fab processing tools knowledge/experience. • MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree. 0-2 years experience required with BS. • Knowledge of DOE, SPC, and 6-sigma concepts and applications is a plus. • Project Management skills and/or defined training a plus. • Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. • Can work both independently and in cross-functional teams for problem solving.   US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.