What are the responsibilities and job description for the NAND Package Quality and Reliability Engineer position at Solidigm?
Company Overview
Solidigm is a global company at the forefront of innovation in the memory industry, combining cutting-edge technology, diverse talent, and operational scale to drive growth and success.
We are headquartered in Rancho Cordova, California, with international presence in Asia, Europe, and the Americas. Our vision is to lead the world in innovating new Memory technologies and become the #1 NAND memory company.
We view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds.
Our culture fosters a diverse, equitable, and inclusive environment that empowers individuals to bring their best selves to deliver excellence in support of our vision and mission to be the go-to partner for optimized data storage solutions.
This is an exciting opportunity to join a dynamic team of dedicated professionals who will shape the future of Solidigm and contribute to its growth and success.
Job Description
The Validation, Quality and Reliability team is responsible for ensuring product reliability through all phases of the product life cycle, from technology development and pathfinding, product design validation, manufacturing, to high volume manufacturing (HVM) of Solidigm's 3D NAND memory packages and Solid-State Drives (SSDs).
As a NAND package quality and reliability engineer, you will develop and qualify innovative semiconductor package technologies for Solidigm's latest products.
You will influence the design, material selection, and process development of the new package technology to meet product needs, using a wide variety of skills, from analytical models, advanced experimental designs, and extensive data analysis, to evaluate and improve the package technology and package-board interactions.
Responsibilities:
- Influence new package/board design, process, and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and package-board interactions.
- Perform package and board design/assembly risk assessments and develop a qualification plan supporting product launch.
- Collection and analysis of all stress test data (HAST, TC, Precon, HTS, SJR).
- Design test vehicles to isolate failure mechanisms and root causes, e.g., daisy chain test vehicle (DC TV).
- Innovate analytical and experimental methods to validate package technology reliability, especially with respect to SJR.
- Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.
The ideal candidate should exhibit the following behavioral traits:
- Team player willing to collaborate across multiple functions.
- Verbal and written communication skills.
- Self-motivated.
Qualifications
Minimum Qualifications
- Candidate must possess a Bachelor's degree in Mechanical Engineering, Material Science or related field.
- 4 years of experience in semiconductor package development and reliability.
- Able to engage in root cause analysis, design of experiments, and data analysis.
- Excellent communication skills to work effectively across different geographies.
Preferred qualifications:
- Hands-on experience of fault isolation and failure analysis, including electrical testing, layout analysis, daisy chain TV design.
- Knowledge of Printed Circuit Board (PCB) assembly processes and package to board interconnects.
- Knowledge of package and board design software (Cadence Allegro/Mentor).
Additional Information
We offer competitive compensation and benefits packages, including medical, dental, and vision insurance, 401(k) matching, and paid time off.
