What are the responsibilities and job description for the Semiconductor Quality Assurance Engineer position at Solidigm?
About the Role
This NAND package quality and reliability engineer role is responsible for developing and qualifying innovative semiconductor package technologies for our latest products, ensuring they meet the highest standards of quality and reliability.
Main Responsibilities
- Influence new package/board design, process, and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and package-board interactions.
- Perform package and board design/assembly risk assessments and develop a qualification plan supporting product launch.
- Collection and analysis of all stress test data (HAST, TC, Precon, HTS, SJR).
- Design test vehicles to isolate failure mechanisms and the root causes, e.g., daisy chain test vehicle (DC TV).
- Innovate analytical and experimental methods to validate package technology reliability, especially with respect to SJR.
Requirements
- Bachelor's degree in Mechanical Engineering, Material Science, or related field.
- 4 years of experience in semiconductor package development and reliability.
- Able to engage in root cause analysis, design of experiments, and data analysis.
- Excellent communication skills to work effectively across different geographies.
