What are the responsibilities and job description for the LEAD ENGINEER - SR. RESEARCH ENGINEER - Process / Manufacturing of Space Flight Electronics position at Southwest Research Institute?
Who We Are :
A team of engineers and technicians in SwRI's Space Sector who facilitate space science research through the fabrication and inspection of electronic printed circuit boards for spacecraft instrumentation, avionics, and electronics.
Objectives of this Role :
Manufacturing Engineer to lead printed circuit board (PCB) fabrication of the Space Systems Division.
Manufacture of sophisticated one-of-a kind systems that contribute to the exploration and research of space, advance scientific knowledge and safeguard our nation's security.
Fabrication of printed circuit boards in a low-volume, high mix R&D environment to meet wide-ranging requirements from quick turn prototypes to space-flight certified electronics with a meticulous attention to detail.
The ability to function as a contributing member of a Fabrication team providing guidance, training and expertise to area personnel.
Establish new processes and provide ongoing process improvements, root cause analysis and corrective / prevention actions in an R&D engineering environment.
Daily and Monthly Responsibilities :
Maintain space flight hardware PCB assembly processes, procedures and training that includes cleaning and soldering of both Surface Mount and through hole electronics to IPC-A-610 Class 3 and IPC-J-Std-001 w / Flight Addendum standards.
Responsible for the qualification, operation, preventative maintenance, trouble shooting and repair of area equipment to include solder jet pasting, pick and place, vapor phase reflow, selective soldering, component storage, lead forming and optical monitoring equipment.
Provide technical training in soldering and manufacturing techniques, methods and processes to fabrication technicians.
Support Controlled Stores operations providing safe and effective storage and control of Program and Division components and inventory.
Establish and perform process controls, measurements and product inspections.
Documenting and Creating Division Operating Processes and procedures including written work instructions.
Requirements :
Requires a Bachelors degree in Materials Science and Engineering, Mechanical Engineering, Electrical Engineering, Mechatronics Engineering, Manufacturing Engineering or Process Engineering.
Six Sigma, ANSI / ESD S20.20, IPC-J-STD-001, NASA 8739, Vacuum Processing and / or Lean Manufacturing are preferred.
5 years : Possess strong troubleshooting skills and familiarity with defect analysis techniques.
5 years : Experience and use of Designed Experiments, Six Sigma, Continuous Improvement, Lean and DfX.
5 years : PCB design or assembly and fabrication. Knowledge of electronic components, soldering and solder reflow principles and requirements, ESD control and mitigation. Knowledge of staking and coating processes and procedures
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