What are the responsibilities and job description for the Tara Technical Solutions (TTS) is hiring: Packaging Designer in Sunnyvale position at Tara Technical Solutions (TTS)?
Content Summary : Packaging Designer at Sunnyvale, for Tara Technical Solutions (TTS)
Senior Packaging experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs .
FULL-TIME- Direct Hire Fortune 500 Client-
San Jose OR Austin Or Fort Collins.
Developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.
RESPONSIBILITIES :
- Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
- 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest (3 or more years is preferred)
- Package Design of critical structures for SerDes, ADC / DAC, DDR, etc.
- Schedule, prioritize, & track your work across 2 projects simultaneously
- General flip-chip BGA package design & engineering
- Project management and customer interface for your design projects
- Contribute to efficiency improvements for the design
EDUCATION / EXPERIENCE & REQUIREMENTS :
