What are the responsibilities and job description for the Product Development Engineering Leader position at Tenstorrent?
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
We are seeking an experienced Product Development and Manufacturing Leader to lead and optimize the end-to-end manufacturing lifecycle for our custom silicon and semiconductor products. This role will oversee design services, outsourced assembly and test (OSAT), foundry operations, testing, packaging, product quality, yield, and cost management. The ideal candidate will have deep expertise in semiconductor operations, strong leadership skills, and a proven ability to drive high-volume production from NPI to HVM.
This role is hybrid, based out of Santa Clara, Austin, Fort Collins, or Toronto.
Key Responsibilities
- Product Understanding : Develop and maintain comprehensive knowledge of product IP, chiplets, and SoCs, with a focus on understanding mission-mode usage as well as customer needs.
- Oversee manufacturing at foundry and OSAT, ensuring alignment with cost, quality, and yield targets.
- Lead NPI to HVM ramp for multiple custom silicon generations, including advanced technology nodes (5nm, 4nm, 3nm, and beyond).
- Establish and implement manufacturing process control strategies to optimize yield, improve reliability, and enhance efficiency.
- Develop and maintain quality and reliability management systems, ensuring robust validation and compliance across all manufacturing stages.
- Drive packaging and test strategies, overseeing product engineering efforts to improve cost efficiency and time to market.
- Build and scale engineering operations teams, providing leadership in backend product engineering, failure analysis, and validation.
- Collaborate with design, supply chain, and product teams to ensure seamless execution of manufacturing programs.
- Work with supply chain to analyze and improve cost structures, optimizing supply chain efficiencies while maintaining quality and performance.
- Develop long-term manufacturing strategies, ensuring scalability, innovation, and alignment with business objectives.
- Build out a Quality and Reliability team : To conduct thorough investigations and analysis to identify root causes of systematic and random issues affecting quality and reliability, effectively addressing customer observations.
- Build out Data Analysis : Analyze characterization and end-to-end manufacturing data from Wafer Acceptance Testing (WAT), sort, package, and system-level tests to uncover failure mechanisms, identify preventive actions, and address weaknesses in test strategies.
- Test Condition Optimization : Ensure that optimal product test conditions are implemented to achieve maximum yield, quality, and performance while identifying test coverage gaps and initiating data-driven improvement plans.
- Cross-Functional Collaboration : Maintain effective communication and collaborative relationships with product stakeholders, including Supply Chain team, Product Engineering and Test teams, Quality and Reliability teams, and IP / Chiplet / SoC design and platform debug leads.
- Responsible for initial Silicon Bring-Up and debugging processes, providing critical feedback and recommendations for changes necessary to facilitate volume production.
Qualifications & Experience
