What are the responsibilities and job description for the [Summer 2025] Module Process Engineer Intern position at TSMC?
At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.
TSMC Arizona module engineering departments are looking for process engineering internsto join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Process Engineer intern, you will focus on delivering a robust and efficient semiconductor manufacturing process with data driven analytics and systematic problem-solving skills.
Your main responsibilities include, but are not limited to:
Applicants must be legally eligible to work in the United States and have:
Travel : None
TSMC Arizona module engineering departments are looking for process engineering internsto join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Process Engineer intern, you will focus on delivering a robust and efficient semiconductor manufacturing process with data driven analytics and systematic problem-solving skills.
- CMP : Chemical Mechanical Planarization (The dept. responsible for removing excess materials from wafers to create a smooth surface)
- CVD : Chemical Vapor Deposition (The dept. responsible for producing high-quality, and high-performance solid materials through gases reacting to form film deposits on substrate)
- PVD : Physical Vapor Deposition (The dept. responsible for vaporizing solid material in a vacuum and depositing vaporized materials onto a surface of a part)
- EPI : Epitaxy (The dept. responsible for growing or depositing monocrystalline films on a structure or surface)
- DIF : Diffusion (The dept. responsible for forming the source, drain and channel regions in a MOS transistor)
- WET : Wet Clean (The dept. responsible for removing residual particles and other contamination on wafer surfaces)
- ME : Metrology (The dept. responsible for measuring the semiconductor wafer for accuracy)
- Etch : Dry Etch and Wet Etch (The dept. responsible for removing layers or slices of a material via different methods)
- LIT : Lithography (The dept. responsible for drawing highly complex circuit patterns via ultra-high performance lenses onto the wafer)
Your main responsibilities include, but are not limited to:
- Designing and executing experiments, interpreting, and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels.
- Applying statistical process control methods to establish and sustain a robust manufacturing process.
- Qualifying and sustaining manufacturing process to expand capacity with speed and quality.
- Collaborating effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.
- Driving continuous improvements on process stability and capability, quality, reliability, yield, productivity, and safety
Applicants must be legally eligible to work in the United States and have:
- Bachelor, Master or Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or related fields.
- Academic skills of numerical analysis, statistics, optics, chemistry, or physics.
- Knowledge of semiconductor manufacturing process and design would be a strong add.
- Flexibility to change priorities and responsibilities to support business needs
- Willing to work in a clean room environment.
- Polished presentation and interpersonal skills.
- Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
- Must be able to work full time (40 hours per week) on-site at our Phoenix location from
- Semester system: May 19, 2025 – August 1, 2025
- Quarterly system: June 16, 2025 -- August 30, 2025
- Able to adapt priorities and responsibilities to support business needs.
- Hands-on participant with a strong sense of ownership
- An excellent team player with leadership skills that can multitask and thrive in a very dynamic and fast-paced environment.
- Goal driven with demonstrated ability of working in a high performing team culture.
- Quick assimilation to new technology.
- Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.
Travel : None
