[Summer 2025] TSMC AZ Internship Opportunities

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona module engineering departments are looking for equipment engineering talentsto join our advanced technology fab, located in sunny Phoenix, Arizona. As an Equipment/Process Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

Equipment Engineer is focusing on improving tool performance and availability while meeting uptime and cycle time requirements.

• CMP : Chemical Mechanical Planarization
• CVD : Chemical Vapor Deposition
• PVD : Physical Vapor Deposition
• EPI : Epitaxy
• DIF : Diffusion
• WET : Wet Clean
• ME : Metrology
• Etch : Wet Etch and Dry Etch
• LIT : Lithography
  
  

Job Description

Your main responsibilities include, but are not limited to:

• Maintain equipment performance in clean room environment for quality production.
• Handling on-duty and fundamental alarm troubleshooting.
• Installing/qualifying new tool sets according to planned schedule in a timely manner.
• Finding root cause and solving critical equipment issues.
• Improving tool uptime availability and driving defect reduction.
• Identifying and pursuing opportunities for hardware capability enhancement.
• Building defense/monitoring system to prevent equipment failure or performance lost.
• Managing vendor relationships and being responsible for module liaison with facilities, vendor, and manufacturing shift personnel.
  
  

Process Engineer is focusing on delivering a robust and efficient semiconductor manufacturing process with data driven analytics and systematic problem-solving skills.

• CMP : Chemical Mechanical Planarization
• CVD : Chemical Vapor Deposition
• PVD : Physical Vapor Deposition
• EPI : Epitaxy
• DIF : Diffusion
• WET : Wet Clean
• ME : Metrology
• Etch : Wet Etch and Dry Etch
• LIT : Lithography
  
  

Your Main Responsibilities Include, But Are Not Limited To

• Designing and executing experiments, interpreting, and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels.
• Applying statistical process control methods to establish and sustain a robust manufacturing process.
• Qualifying and sustaining manufacturing process to expand capacity with speed and quality.
• Collaborating effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.
• Driving continuous improvements on process stability and capability, quality, reliability, yield, productivity, and safety.
  
  

Minimum Qualifications

Applicants must be legally eligible to work in the United States and have:

• Bachelor, Master or Ph.D. in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, or related fields.
• Academic skills of numerical analysis, statistics, optics, chemistry, or physics.
• Knowledge of semiconductor manufacturing process and design would be a strong add.
• Flexibility to change priorities and responsibilities to support business needs
• Willing to work in a clean room environment.
• Polished presentation and interpersonal skills.
  
  

Qualifications

Applicants must be legally eligible to work in the United States and have:

• Bachelor's or higher degree in Electronics, Electrical Engineering, Mechanical Engineering, Mechanics, Mechatronics Engineering, or equivalent fields.
• Working experience knowledge in mechanical-related or semiconductor processes is preferred.
• Academic skills of numerical analysis, statistics, optics, chemistry, or physics.
• At least 1 year experience in semiconductor industry as Equipment Engineer is a strong add.
• Able to lift weight consistent with applicable regulations and/or safety guidelines, including NIOSH lifting recommendations.
• Able to work in a cleanroom environment, gowning up in coveralls, hoods, boots, safety glasses and gloves. Spend significant amount of time on the factory floor working on the tools.
• All Equipment Engineers (EE) may be required to work a Compressed Work Week (4-day on, 3-day off, 3-day on, 4-day off), and may be required to work night shift on a rotational basis.
• Night shift rotations are expected to be no more than 4 months per calendar year.
  
  

Personal Attributes

• Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
• Able to take initiatives, adapt priorities and responsibilities to support business needs.
• Hands-on participant with a strong sense of ownership.
• A team player with leadership skills that can multitask and thrive in a very dynamic and fast-paced environment.
• Goal driven with demonstrated ability of working in a high performing team culture.
• Quick assimilation to new technology.
• Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.
  
  

Work Location: Phoenix, AZ

Travel: May require travel dependent on business needs.

Relocation assistance available