What are the responsibilities and job description for the Sr. Technologist – Material Scientist / Thin Film Processes position at Western Digital Capital?
Sr. Technologist – Material Scientist / Thin Film Processes
Full-timeJob Type (exemption status) : Exempt position - Please see related compensation & benefits details belowSalary Range : 160,565.00-227,400.00Business Function : Hardware Development EngineeringWork Location : Fremont Office LOC_WDT_USCA13At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
Make sure to apply quickly in order to maximise your chances of being considered for an interview Read the complete job description below.We are inviting applications for a position in optical and magnetic device fabrication as part of the Wafer Process Development team, where our mission is to invent and develop technology for future products, such as Heat Assisted Magnetic Recording (HAMR). This is an opportunity to work where magnetic, optical and plasmonic devices converge on a nanoscale.In this role, you will work as a Material Scientist and Thin Film Process Engineer at WD’s wafer fab in Fremont, CA. You will be responsible for developing novel materials and thin film processes on near-field transducer and adhesion layer subsystems for fabrication of HAMR devices and focusing on material aspects of improving device lifetime at elevated operating temperature. The job requires interfacing with engineers and scientists in process integration, characterization, and design groups.Minimum Qualifications
PhD degree in one of the following areas : Materials Science, Physics, Chemistry, or EngineeringMinimum five years of experience in semiconductor, optical / plasmonic and / or magnetic device fabrication. Experience in thin film magnetic head is preferred.Expertise in vacuum thin film process technology such as PVD, CVD, IBD, ALD and RTA.Familiar with wafer-level material characterization such as TEM, XRD, AFM, SEM, ellipsometry and surface analysis techniques.Strong problem-solving and analytical skills.Aggressive experiment and project management, and wafer tracking.Good data analysis experience utilizing JMP or equivalent industry standard software.Candidate must be innovative, self-driven, detail-oriented and have effective oral and written communication skills.Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion, sex, gender, age, national origin, sexual orientation, medical condition, marital status, physical disability, mental disability, genetic information, military and veteran status, or other legally protected characteristics.Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.#LI-TD1Compensation & Benefits Details
An employee’s pay position within the salary range may be based on several factors including but not limited to relevant education, qualifications, certifications, experience, skills, and performance.You will be eligible to participate in Western Digital’s Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance.We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical / dental / vision insurance; life, accident and disability insurance; and more.
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