Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in execution of process integration in clean room to make sure projects are completed successfully and delivered on time.
Responsibilities:
Assisting engineer to work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
Responsible for assisting in developing advanced 2.5D and 3D SiP MEOL and assembly flows
Owner for execution of module process, data collection for measurement & inspection to validate each process in integration
Interact with internal and external module process owners to align for tool time, execute process sequence and collect data to feedback to integration owner
Occasional over-time to support process engineering activities
Requirements:
ITE/ Diploma in Engineering or relevant studies
Basic understanding on semiconductor process is preferred
Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be added advantages
Candidates with minimum experiences are welcome to apply
Qualifications
Education:
Technical DiplomaSkills:
Certifications:
Languages:
Years of Experience:
2 - 4 YearsWork Experience:
Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
NoRelocation Eligible:
NoApplied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
Engineer, Advanced Packaging Integration Engineering
Micron Technology, Singapore, Singapore
Engineer, Advanced Packaging Process and Equipment Technology Development Engineering
Micron Technology, Singapore, Singapore