What are the responsibilities and job description for the Manufacturing Technician - Electronics position at gonzer?
Details :
Process engineering position in Microfabrication lab. The successful candidate will interact with and contribute to technical teams covering a wide spectrum of exciting and innovative research and semiconductor technology projects. Currently the Packaging / Microfabrication Team is working with teams in nanotechnology, advanced semiconductor packaging, biosensors, quantum computing and advanced wafer testing. . Photolithographic processing in a clean room environment as well as other thin film techniques and wet chemical processing are important steps in this work. Excellent sample handling practices and dexterity are an absolute must. Applicants for this position must be highly motivated, excellent problem solvers, innovative and possess strong team skills with the ability to work effectively in a diverse environment.
Job Requirements
Details :
- Process wafers and / or other substrates through plating, lithography (coat, expose, develop), wet and dry etch, clean, thin film vacuum deposition, packaging, etc.
- Identify, communicate, and solve problems, organize projects and workflow.
- Accurately document and summarize data and process steps, as specified.
- Work closely with Engineers, Scientists, and Inventors from many different disciplines. Must be able to work independently as well as be a good team player.
- Have a working knowledge of Microsoft Office
