Demo

Thermal Engineer

Celestial AI
Santa Clara, CA Full Time
POSTED ON 2/9/2025
AVAILABLE BEFORE 5/9/2025

Job Description

Job Description

About Celestial AI

As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system's interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI's Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions.

The Photonic Fabric™ is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies.

This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. To bolster customer collaborations, Celestial AI is developing a Photonic Fabric ecosystem consisting of tier-1 partnerships that include custom silicon / ASIC design, system integrators, HBM memory, assembly, and packaging suppliers.

ABOUT THE ROLE

In this role you will utilize your broad semiconductor packaging thermal experience to drive Celestial AI's Photonic Fabric solutions from concept to high volume manufacturing. You will be responsible for thermal modeling, testing and characterization working with cross-functional teams including Packaging, ASIC, AMS, Photonics, and external partners to meet product performance requirements. This job will require you to have strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and work on projects with a high sense of urgency.

ESSENTIAL DUTIES AND RESPONSIBILITIES

  • Perform die / package / system thermal modeling for high-performance computing packages including 2.5D and 3D heterogeneous architectures
  • Support design and manufacturing of thermal management solutions meeting thermal performance and mechanical design requirements, including recommendation for material selection
  • Work with cross-functional teams including mechanical design to drive ideation and innovation of advanced package thermal solutions and specifications with vendors to advance productization efforts by Celestial AI
  • Support thermal test vehicle definition, testing, and characterization to enable robust product solutions including implementation of electronics cooling technologies
  • Develop and maintain documentation, guidelines to support thermal hardware design and implementation
  • Prepare and present technical documentation to stakeholders, including internal cross-functional teams and customers

QUALIFICATIONS

  • BS / MS / PhD in Mechanical Engineering / Materials Science or related disciplines
  • 5 years of experience in thermal modeling, testing and characterization for IC packages including 2.5D and 3D heterogeneous architectures
  • Proficiency with CFD modeling tools such as Icepak and Flotherm
  • Hands-on experience with electronics cooling technologies and implementation for bring up
  • Knowledge and insights for efficient thermal management of high-performance computing packages
  • Familiarity with photonics packaging is a plus but not necessary
  • Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
  • Experience in project management and communicating technical and project / program status and issue resolution at all levels of the engineering organization
  • Effective communicator, comfortable engaging with internal cross functional teams as well as domestic and overseas partners
  • Excellent attention to detail, process and operationally oriented with the ability to work independently and take projects to completion with minimum supervision
  • LOCATION : Santa Clara, CA

    For California Location :

    As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $175,000.00 - $200,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.

    We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.

    Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.

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    Salary : $175,000 - $200,000

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