What are the responsibilities and job description for the Thermal Engineer position at Zachary Piper Solutions, LLC?
Job Details
Piper Companies is seeking a senior Thermal Engineer with strong experience developing thermal cooling strategies with specialized hardware. The ideal Thermal Engineer must be willing to work onsite 5 days a week in Saratoga, CA.
Requirements for the Thermal Engineer include:
Develop thermal cooling strategies for high-performance ASIC's.
Conduct engineering tests to verify designs and support thermal analysis for hardware devices.
Perform package design for custom Si single-chip and multi-chip
Conduct design analysis and scenarios for novel packaging technologies, including liquid cooling and mechanical design of robust package substrates
Qualifications for the Thermal Engineer include:
10 years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing
3-5 years of direct professional experience in thermal design; using Icepak, FloTherm, SmartCFD, etc.
Experience with high power SOC liquid cooling design and analysis
Advanced understanding of electric cooling challenges in data center environments and heat transfer modes
Bachelors in Material Science, Mechanical Engineering, or equivalent industry experience
Must be eligible to work in the United States and obtain and maintain an Active U.S Government Secret Clearance
Compensation for the Thermal Engineer include:
Salary range: $160,000 - $200,000 annually
Comprehensive benefit package; Cigna Medical, Cigna Dental, Vision, 401k w/ ADP plus PTO, Sick leave if required by law, and Paid Holidays
Requirements for the Thermal Engineer include:
Develop thermal cooling strategies for high-performance ASIC's.
Conduct engineering tests to verify designs and support thermal analysis for hardware devices.
Perform package design for custom Si single-chip and multi-chip
Conduct design analysis and scenarios for novel packaging technologies, including liquid cooling and mechanical design of robust package substrates
Qualifications for the Thermal Engineer include:
10 years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing
3-5 years of direct professional experience in thermal design; using Icepak, FloTherm, SmartCFD, etc.
Experience with high power SOC liquid cooling design and analysis
Advanced understanding of electric cooling challenges in data center environments and heat transfer modes
Bachelors in Material Science, Mechanical Engineering, or equivalent industry experience
Must be eligible to work in the United States and obtain and maintain an Active U.S Government Secret Clearance
Compensation for the Thermal Engineer include:
Salary range: $160,000 - $200,000 annually
Comprehensive benefit package; Cigna Medical, Cigna Dental, Vision, 401k w/ ADP plus PTO, Sick leave if required by law, and Paid Holidays
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
Salary : $160,000 - $200,000
