Description

TITLE:                        PROCESS INTEGRATION ENGINEER

FLSA STATUS:          EXEMPT

REPORTS TO:          DIRECTOR, PROCESS CHARACTERIZATION/NPI

SUMMARY:

Under the direction of the Director of Process Characterization/NPI, the Process Integration Engineer is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data.  This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Develops and delivers process integration and characterization techniques for new technology programs and next generation products
• Designs and conducts experiments to verify process robustness; analyzes data, perform FMEA to meet the product requirements.
• Works on characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
• Conducts failure analysis on newly developed processes and recommends corrective action if necessary
• Participates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
• Performs wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool and CD-SEM to identify defects and provides corrective actions to resolve the issues promptly
• Reviews and analyzes backend performance data and makes recommendations to improve performance
• Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teams
• Responds to inquiries from other team members, managers, or departments
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

Qualifications

MINIMUM QUALIFICATIONS:

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferred
• Three years of hands on experience working in the process integration or characterization in a  semiconductor environment in a manufacturing or process engineering role
• Hands’ on experience using JMP or similar analytical application
• Proficient in the use of Microsoft Office Applications

Required Knowledge, Skills, and Abilities:

• Knowledge of process integration and characterization principles, practices, and techniques  
• Knowledge of magnetic recording head or HDD manufacturing
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual base salary for this full-time position is between $96,655.20-$142,140.00 bonus target benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Process Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask.  May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.

*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics.  Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.